Shielded Electronic Component Module With Protruding Solder Terminals
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Solution Overview
Problem
The existing hybrid ICs face issues with solder bonding quality due to solder mounting on planar electrodes, and they lack sufficient cleanability and resin filling properties, especially when the gap between the mounting substrate and the hybrid IC is narrow. Additionally, the components lack shielding properties.
Innovation Solution
An electronic component module is designed with a plurality of components having terminals arranged along a plane, covered by a sealing resin portion and a shield conducting film. The terminals of the chip components protrude from the sealing resin portion, allowing for reliable solder bonding and improved cleanability and resin filling properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If solder bumps are formed on planar electrodes with components covered by resin, then the hybrid IC structure is simplified, but solder bonding quality deteriorates
Solution Approach 1:
The invention extracts the terminal portions of components from the resin-covered area, allowing terminals to protrude from the resin surface. This enables solder bonding to occur on exposed terminals rather than on planar electrodes covered by resin, thereby resolving the solder bonding quality issue while maintaining the simplified hybrid IC structure.
Solution Approach 2:
The invention transitions from a two-dimensional planar electrode configuration to a three-dimensional structure where terminals protrude vertically from the resin surface. This dimensional change allows solder bumps to bond effectively with terminals that extend beyond the resin plane, improving solder bonding quality without complicating the overall hybrid IC structure.
2Volume of moving object
If the gap between mounting substrate and hybrid IC is narrow, then the hybrid IC is more compact, but cleanability and resin filling properties become insufficient
Solution Approach 1:
The invention performs preliminary action by forming protruding terminals before the final assembly and soldering processes. These pre-formed protruding terminals create natural spacing and channels that facilitate subsequent cleanability and resin filling operations, ensuring manufacturing ease is maintained even in compact designs.
Solution Approach 2:
The invention applies local quality by creating protruding terminals at specific locations where solder bonding and resin filling are required. This localized structural modification ensures that critical areas have sufficient spacing for cleanability and resin penetration, while other areas can maintain compact dimensions.
3Volume of moving object
If components are completely covered by resin, then the hybrid IC is more compact and protected, but shielding properties are lost
Solution Approach 1:
The invention extracts terminal portions from the resin-covered area, creating protruding terminals that extend beyond the resin surface. This selective exposure of terminals provides electromagnetic shielding for the covered component bodies while maintaining electrical connectivity through the protruding terminals, thus resolving the contradiction between compactness and shielding properties.
Data Source
AI summary
An electronic component module includes a plurality of components having terminals and arranged along a plane, a sealing resin portion that covers and seals these components and has a plane as one plane of an outer surface, and a shield layer that covers the outer surface of the sealing resin portion. Terminals of the plurality of components are exposed in a state of protruding from the plane of the sealing resin portion, and the terminals of these components protruding from the plane of the sealing resin portion are used as mounting terminals of the electronic component module.