Shielded Module Substrate Conductive Members for Housing Integrity
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Solution Overview
Problem
Highly-integrated, miniaturized, and thinned shielded electronic device modules face challenges in shielding measurement and validation processes, where damage and measurement errors can occur due to direct contact and complex configurations.
Innovation Solution
A shielded electronic device module design featuring a substrate with conductive members and a metal housing, where measuring terminals contact the substrate instead of the housing, allowing for accurate conductivity measurement without damaging the module, and additional terminals provide ground voltage and signal paths for improved testing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If direct contact measurement method is used on metal housing, then shielding measurement can be performed, but damage to metal housing occurs
Solution Approach 1:
The patent introduces conductive members embedded in the substrate as intermediary elements between the measurement terminals and the metal housing. These conductive members transmit electrical signals for shielding measurement while preventing direct contact between measurement equipment and the metal housing, thus avoiding damage to the housing structure.
Solution Approach 2:
The measurement system is segmented into separate functional components: measurement terminals on the substrate surface, conductive members embedded in the substrate, and the metal housing. This segmentation allows measurement functions to be performed through the conductive members without requiring direct access to or contact with the metal housing, preventing structural damage.
2Volume of moving object
If highly-integrated and miniaturized design is implemented, then device size is reduced, but shielding measurement complexity increases
Solution Approach 1:
The patent merges the shielding measurement functionality with the substrate structure itself by embedding conductive members directly into the substrate. This integration allows shielding measurements to be performed through the substrate's existing terminal structures, eliminating the need for separate measurement fixtures or complex external setups, thereby simplifying the measurement process despite the miniaturized device size.
3Measurement precision
If multiple conductive members are added for measurement, then measurement accuracy improves, but device complexity increases
Solution Approach 1:
The conductive members embedded in the substrate serve multiple functions: they provide electrical connections for normal device operation and simultaneously serve as measurement terminals for shielding validation. This multi-functionality allows accurate shielding measurements to be performed using existing structural elements, avoiding the need for additional dedicated measurement components that would increase device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents damage to the metal housing during measurement, enhances measurement accuracy, and allows for simultaneous testing of multiple modules, improving the efficiency and reliability of shielding validation processes.
Implementation Method 1
a mounting surface of a substrate shielded by a metal housing
Implementation Method 2
a first planar conductor disposed within the substrate, configured to shield the mounting surface of the substrate, and connected to the metal housing
Data Source
AI summary
A shielded electronic device module includes a substrate that includes a first conductive member and a second conductive member separated from each other, a metal housing covering a mounting space on the substrate and connected to the first conductive member and the second conductive member, and a first terminal and a second terminal disposed on a surface of the substrate and connected to the first conductive member and the second conductive member.