Shielded Module Structure With Trench-Based EMI and Magnetic Isolation

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Solution Overview

Problem

Current module designs for communication devices fail to provide both effective electromagnetic and magnetic shielding as the shielding members either function as electromagnetic shields or magnetic shields, but not both simultaneously, leading to inadequate protection as component density increases.

Innovation Solution

A module design incorporating a substrate with electronic components, a sealing resin, a ground electrode, a conductive layer, and a magnetic member, where the conductive layer acts as an electromagnetic shield and the magnetic member serves as a magnetic shield, with a connecting conductor and magnetic wall member filling trenches to ensure both types of shielding are achieved.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a single shielding member is used, then the structure is simple, but it cannot provide both electromagnetic and magnetic shielding functions

Engineering Contradiction:
Improveshielding functionVSAvoidshielding structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines the electromagnetic shielding function (conductive layer) and magnetic shielding function (magnetic member) into a single integrated shielding structure. The conductive layer and magnetic member are arranged in specific spatial relationships (one above the other, or side by side) to simultaneously provide both shielding functions without requiring separate independent structures.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shielding structure is designed to perform multiple functions: the conductive layer provides electromagnetic wave shielding while the magnetic member provides magnetic field shielding. This multi-functional design allows a single shielding system to address both electromagnetic and magnetic interference issues that arise from high-density component mounting.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Volume of moving object

If high-density component mounting is implemented, then size reduction is achieved, but electromagnetic and magnetic interference increases

Engineering Contradiction:
Improvemodule sizeVSAvoidelectromagnetic and magnetic interference
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent applies different shielding materials and structures in different spatial locations within the module. The conductive layer is positioned in certain areas while the magnetic member is positioned in other areas, creating localized shielding zones that address interference problems specific to high-density component arrangements without compromising the compact size.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively satisfies both electromagnetic and magnetic shielding requirements, reducing the risk of damage during trench formation and optimizing space for component mounting while providing reliable shielding along desired paths.

Implementation Method 1

a conductive layer covering the sealing resin... functioning as the electromagnetic shield

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

a magnetic member including a magnetic plate member arranged so as to cover the sealing resin and a magnetic wall member arranged in a wall shape in the trench... functioning as the magnetic shield

Methodology Applied
Scientific EffectMagnetic shielding: Magnetism

Data Source

PatentUS11804448B2Module
Publication Date: 2023.10.31 MURATA MFG CO LTD
  • US11804448B2 patent drawing
  • US11804448B2 patent drawing
  • US11804448B2 patent drawing

AI summary

A module is provided with a substrate including a principal surface, a plurality of electronic components arranged on the principal surface, a sealing resin covering the principal surface and the plurality of electronic components and including a trench between any of the plurality of electronic components, a ground electrode arranged on the principal surface, a conductive layer covering the sealing resin, and a magnetic member. The conductive layer is electrically connected to the ground electrode by a connecting conductor arranged so as to penetrate the sealing resin. The magnetic member includes a magnetic plate member arranged so as to cover the sealing resin and a magnetic wall member arranged in a wall shape in the trench. The connecting conductor and the magnetic wall member both fill the trench in a state of being formed in the trench.