Shielded Molding Compound for EMI Reduction in Chip Packages
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Solution Overview
Problem
Electronic devices face challenges in effectively mitigating electromagnetic interference (EMI) due to inadequate shielding, which can impair their performance.
Innovation Solution
A chip package structure incorporating a main substrate, a carrier substrate, a molding compound, and a shielding layer that covers the molding compound and carrier substrate, with electrical connections to ground layers, utilizing materials like aluminum, copper, or silver for effective EMI shielding and enhanced moisture protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding layer is added to cover the molding compound and carrier substrate, then EMI shielding effectiveness is improved, but device complexity increases
Solution Approach 1:
The shielding layer is integrated with the molding compound to form a unified protective structure. The shielding layer conformally covers the molding compound, merging the encapsulation and EMI shielding functions into a single integrated component, thereby reducing overall device complexity while maintaining effective EMI protection.
Solution Approach 2:
The shielding layer serves multiple functions simultaneously: it provides EMI shielding, acts as a moisture barrier, and offers mechanical protection to the underlying structures. This multi-functionality reduces the need for separate components, thereby improving EMI shielding effectiveness without proportionally increasing device complexity.
2Object-affected harmful factors
If the shielding layer is electrically connected to ground layers through connection structures, then EMI shielding effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The shielding layer is designed with pre-configured connection structures that align with ground layers during assembly. The conformal coverage and integrated connection structures are prepared in advance, allowing for simplified assembly processes where the shielding layer is positioned and automatically connected to ground layers, thereby reducing manufacturing complexity while ensuring effective EMI shielding through proper grounding.
3Reliability
If the shielding layer conformally covers the molding compound and carrier substrate, then moisture barrier performance is improved, but device complexity increases
Solution Approach 1:
The shielding layer is merged with the molding compound to create an integrated protective envelope. This conformal integration ensures continuous coverage that prevents moisture ingress while maintaining a streamlined structure, thereby improving moisture barrier performance without adding significant structural complexity.
Solution Approach 2:
The shielding layer simultaneously provides EMI shielding and moisture protection through its conformal coverage. By combining these protective functions into a single layer, the design achieves enhanced reliability against both EMI and moisture without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides robust EMI shielding, improves moisture barrier, and increases the reliability of the chip package by ensuring the shielding layer is fully covering and electrically connected to ground layers, effectively reducing EMI and enhancing package reliability.
Implementation Method 1
a shielding layer conformally covers a top surface and sidewalls of the molding compound and covers an upper sidewall portion of the carrier substrate... the shielding layer fully covering the molding compound and a portion of the carrier substrate of the chip package provide effective EMI shield of the chip package
Implementation Method 2
The molding compound disposed over the carrier substrate at least encapsulates the chip and a portion of the carrier substrate
Implementation Method 3
The at least one chip and the carrier substrate are electrically connected to the main substrate through the plurality of first metal connection structures... The shielding layer is electrically connected to the carrier substrate through the plurality of second connection structures
Data Source
AI summary
A chip package structure including a main substrate, a carrier substrate, at least a chip, a molding compound, a shielding layer and a plurality of connection structures between the main substrate and the carrier substrate. The shielding layer covers the top surface and the sidewalls of the molding compound and a portion of the carrier substrate. The shielding layer is electrically grounded through the connection structures.