Shielded MOM Capacitor with Segmented Middle Plate

The capacitor structure is segmented into multiple functional layers: signal plates (for capacitance function), shielding plates (for parasitic reduction), and intermediate structures. This segmentation allows each component to perform its specific function independently, achieving low RC parasitic capacitance through dedicated shielding layers while maintaining the capacitance function through signal plates.

Intermediate structures (such as intermediate shielding plates or dielectric layers) are introduced between the signal plates and external environment to mediate the electrical interaction. These intermediary elements act as buffers that reduce parasitic coupling while maintaining the primary capacitance function, effectively lowering RC parasitic capacitance.

The capacitor design transitions from a planar two-dimensional layout to a three-dimensional stacked structure with multiple layers in the vertical dimension. By stacking signal plates and shielding plates vertically, the capacitance increases through additional capacitive elements in series/parallel combinations, while the footprint area remains constrained to the substrate plane, achieving high unit capacitance with minimal area occupation.

The capacitor employs composite material structures combining different dielectric materials with varying permittivity values in different layers. High-k dielectric materials are strategically positioned to maximize capacitance density in specific regions, while low-k materials are used in other areas to reduce parasitic effects. This composite approach enables achieving the required 1fF unit capacitance within limited area by optimizing the electrical properties of each material layer.