Shielded Electronic Components with Ni Plating on Sealant
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Solution Overview
Problem
Existing shielded electronic components face issues with reliability in reflow resistance and adhesiveness due to plating film expansion and exfoliation, especially when exposed to high humidity and temperature cycles, leading to reduced shielding effectiveness and potential short-circuiting.
Innovation Solution
A metal plating film is formed using high-pressure CO2 on the top surface of a sealant, with Pd metal particles created to enhance anchor effects, and non-electrolytic Ni plating is applied to improve adhesiveness and prevent CO2 infiltration, ensuring strong electrical connections and shielding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal plating film is formed on the sealant surface, then shielding effectiveness is improved, but the plating film expands and exfoliates under high humidity and temperature cycles, reducing reliability
Solution Approach 1:
The patent applies a primer layer to the sealant surface before forming the metal plating film. This preliminary action creates a protective intermediate layer that prevents the plating film from expanding and exfoliating under high humidity and temperature cycles, while still allowing the plating to provide electromagnetic shielding effectiveness.
Solution Approach 2:
The patent uses a composite structure consisting of the sealant, primer layer, and metal plating film. This composite material approach combines the shielding properties of metal with the adhesive and environmental resistance properties of the primer and sealant, preventing exfoliation while maintaining shielding effectiveness.
2Object-affected harmful factors
If a metal plating film is formed on the sealant surface, then shielding effectiveness is improved, but adhesiveness between the plating and sealant deteriorates, leading to potential short-circuiting
Solution Approach 1:
The patent introduces a primer layer as an intermediary between the sealant and the metal plating film. This primer acts as a mediator that improves the chemical and mechanical bonding between the organic sealant surface and the inorganic metal plating, preventing adhesion failure and potential short-circuiting while allowing the metal layer to provide shielding.
3Strength
If high-pressure CO2 is used to form Pd metal particles, then anchor effects are enhanced, but CO2 infiltration may occur, requiring additional protective measures
Solution Approach 1:
The patent applies the primer layer to the sealant surface before exposing it to high-pressure CO2 for Pd particle formation. This preliminary protective coating prevents CO2 infiltration into the sealant bulk while still allowing the CO2 to interact with the primer surface to form Pd metal particles that enhance anchor effects for subsequent plating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides electronic components with enhanced reflow resistance and adhesiveness, maintaining effective shielding against electromagnetic noise and preventing short-circuiting, even under harsh environmental conditions.
Implementation Method 1
A metal plating film is formed using high-pressure CO2 on the top surface of a sealant, with Pd metal particles created to enhance anchor effects
Implementation Method 2
non-electrolytic Ni plating is applied to improve adhesiveness and prevent CO2 infiltration, ensuring strong electrical connections and shielding reliability
Data Source
AI summary
A shielded electronic component including a wiring board, at least one semiconductor chip mounted on a main surface of the wiring board, a sealant which seals the whole of an upper surface of the wiring board, and a nickel (Ni) plating film formed on an upper surface of the sealant is provided. The Ni plating film is formed on a palladium (Pd) pretreatment layer formed on the upper surface of the sealant with using high-pressure CO2 in a state of protecting a back surface of the wiring board, and is electrically connected with an end portion of a ground wiring layer of the wiring board or a ground (GND) connection through-hole connected with the end portion of the ground wiring layer.