Shielded Semiconductor Package for Heat Dissipation and EMI Control
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Solution Overview
Problem
Semiconductor packages face challenges in efficiently dissipating heat and maintaining electrical reliability due to increasing power consumption, which affects their thermal properties and reliability.
Innovation Solution
A semiconductor package design incorporating a heat-dissipating structure with an adhesive layer and a shield layer that extends into holes penetrating the molding film, heat-dissipating structure, and adhesive layer, enhancing heat dissipation and electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If power consumption is increased to achieve high rate and high capacity, then semiconductor package performance is improved, but heat dissipation becomes more difficult and thermal properties deteriorate
Solution Approach 1:
The semiconductor package is divided into multiple functional layers including substrate, semiconductor chips, molding film, and shield layer. Each layer is optimized for its specific function, with the shield layer specifically designed to address thermal and electromagnetic issues generated by high-power operation.
Solution Approach 2:
The shield layer acts as an intermediary component between the semiconductor chips and the external environment. It serves dual functions as both a mechanical support structure and an electromagnetic/thermal management layer, absorbing and dissipating heat while shielding electromagnetic interference.
2Productivity
If power consumption is increased to achieve high rate and high capacity, then semiconductor package performance is improved, but electrical reliability deteriorates due to increased thermal stress
Solution Approach 1:
Different regions of the semiconductor package are designed with different properties. The shield layer is positioned specifically around the semiconductor chips where heat generation is most intense, providing localized thermal and electromagnetic management where it is most needed to maintain reliability under high-power conditions.
3Reliability
If shield layer is added to improve electromagnetic interference shielding, then electrical reliability is improved, but device complexity increases
Solution Approach 1:
The shield layer is designed to perform multiple functions simultaneously: it provides electromagnetic interference shielding, serves as a thermal management structure, and acts as a mechanical support element. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while achieving improved electrical reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves thermal properties by direct heat transfer and reduces electrical shorts, while the shield layer enhances electromagnetic interference shielding, leading to improved reliability and electrical performance.
Implementation Method 1
an adhesive layer between the first semiconductor chip and the heat-dissipating structure
Implementation Method 2
a shield layer on an upper surface and sidewalls of the molding film, wherein the shield layer includes a first portion extending into a first hole and contacting an upper surface of the first semiconductor chip
Data Source
AI summary
A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a heat-dissipating structure on the first semiconductor chip, an adhesive layer between the first semiconductor chip and the heat-dissipating structure, a second semiconductor chip on the heat-dissipating structure, a molding film on the substrate and covering at least portions of the first semiconductor chip, the heat-dissipating structure, and the second semiconductor chip, and a shield layer on an upper surface and sidewalls of the molding film, wherein the shield layer includes a first portion extending into a first hole and contacting an upper surface of the first semiconductor chip, and the first hole may penetrate the molding film, the heat-dissipating structure, and the adhesive layer.