Shielded Package With Integrated Antenna And Isolated EMI Shield
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Solution Overview
Problem
Packaged semiconductor devices with RF components face challenges in integrating antennas and shielding efficiently, leading to increased volume and the need for customers to add shields and antennas post-manufacture, which complicates FCC certification.
Innovation Solution
The integration of an electromagnetic interference (EMI) shield isolated from the interconnect structure, allowing direct attachment of an antenna connector or substrate to the EMI shield's external surface, with electrical isolation from the grounded shield, enabling FCC certification at the supplier level.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield is constructed of metal and attached to the PCB board over and around the RF module, then electromagnetic interference protection is improved, but space on the board is consumed and device volume increases
Solution Approach 1:
The patent combines the EMI shield and antenna into a single integrated structure. The shield serves dual purposes: protecting the RF module from electromagnetic interference and functioning as the antenna itself. This merging eliminates the need for separate shield and antenna components, reducing device volume while maintaining EMI protection.
Solution Approach 2:
The metal shield is designed to perform multiple functions simultaneously: it acts as an EMI barrier, an antenna for wireless communication, and a structural component of the package. This multi-functionality reduces the number of separate components needed, thereby decreasing overall device volume while maintaining all required functions.
2Ease of manufacture
If the shield and antenna are not an integral part of the device, then manufacturing flexibility is improved, but FCC certification complexity increases and customer assembly is required
Solution Approach 1:
The EMI shield and antenna are manufactured as a single integrated component rather than separate parts. This integration simplifies the overall device structure and allows the supplier to deliver a complete, FCC-certifiable product that requires no additional assembly by the customer, thereby reducing certification complexity.
Solution Approach 2:
The EMI shield is pre-configured with integrated antenna functionality during the manufacturing process. This preliminary integration of the antenna into the shield structure allows for pre-certification by the supplier, eliminating the need for customers to perform additional assembly and certification steps.
3Object-affected harmful factors
If space between the shield and components is maintained, then shielding effectiveness is improved, but valuable PCB space is consumed
Solution Approach 1:
The shield and antenna are merged into a single structure, eliminating the need for separate spacing between shield and antenna components. The integrated design allows the antenna to be formed using the shield structure itself, maximizing space utilization on the PCB while maintaining shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces device volume by integrating shielding and antennas within the semiconductor package, streamlining FCC certification and enhancing thermal management in compact applications.
Implementation Method 1
The integration of an electromagnetic interference (EMI) shield isolated from the interconnect structure, allowing direct attachment of an antenna connector or substrate to the EMI shield's external surface
Data Source
AI summary
A semiconductor structure includes a packaged semiconductor device having at least one device, a conductive pillar, an encapsulant over the at least one device and surrounding the conductive pillar, wherein the conductive pillar extends from a first major surface to a second major surface of the encapsulant, and is exposed at the second major surface and the at least one device is exposed at the first major surface. The packaged device also includes a conductive shield layer on the second major surface of the encapsulant and on minor surfaces of the encapsulant and an isolation region at the second major surface of the encapsulant between the encapsulant and the conductive pillar such that the conductive shield layer is electrically isolated from the conductive pillar. The semiconductor structure also includes a radio-frequency connection structure over and in electrical contact with the conductive pillar at the second major surface of the encapsulant.