Shielded Semiconductor Package Layout With Interconnect-Coupled EMI Control

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Solution Overview

Problem

Conventional semiconductor packages face issues of high cost, decreased reliability, and large size, leading to suboptimal performance.

Innovation Solution

A semiconductor structure and manufacturing method that includes a substrate with a conductive structure, a shielding terminal, an electronic component, a package body, and a shield interconnect, which enhances electromagnetic interference (EMI) shielding efficiency by using multiple shield layers and interconnects to connect the shield to the shielding terminal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor packages are used, then manufacturing is simpler, but EMI shielding efficiency is insufficient and reliability decreases

Engineering Contradiction:

ImproveEMI shielding efficiencyVSAvoidpackage structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The shielding structure is divided into multiple discrete shield layers (first shield layer, second shield layer, third shield layer) positioned at different locations within the package body. Each layer serves as an independent EMI barrier, collectively providing comprehensive shielding coverage without requiring a single complex continuous shield structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The shield layers are nested within the package body structure, with the first shield layer positioned near the top surface, the second shield layer surrounding the conductive structure, and the third shield layer positioned near the bottom surface. This nested arrangement maximizes shielding effectiveness within the constrained package volume.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Volume of moving object

If package size is reduced, then integration is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvepackage sizeVSAvoidshield layer positioning

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

Different shield layers are positioned at specific critical locations within the package body where EMI protection is most needed. The first shield layer is positioned near the top surface to shield upper components, the second shield layer surrounds the conductive structure to provide localized shielding, and the third shield layer is positioned near the bottom surface to shield lower components, optimizing protection where required rather than uniform shielding throughout.

Inventive Principle:

Principle #3Local quality

3Reliability

If multiple shield layers are added, then EMI shielding efficiency improves, but manufacturing complexity increases

Engineering Contradiction:

ImproveEMI shielding efficiencyVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The shield layers are positioned and secured within the package body before the final encapsulation process. The first shield layer is positioned near the top surface, the second shield layer is positioned around the conductive structure, and the third shield layer is positioned near the bottom surface, allowing each layer to be independently installed and verified before final sealing, simplifying the overall manufacturing process.

Inventive Principle:

Principle #10Preliminary action

4Reliability

If shield interconnects are used to connect shield to shielding terminal, then electrical coupling is improved, but device complexity increases

Engineering Contradiction:

Improveelectrical couplingVSAvoidinterconnect structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The shield interconnect acts as an intermediary element that electrically couples the shield layers to the shielding terminal of the conductive structure. The interconnect provides a dedicated electrical pathway that simplifies the connection architecture compared to direct bonding or multiple discrete connections, reducing overall system complexity while ensuring reliable electrical coupling for EMI shielding functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces EMI, increases reliability, and potentially decreases costs by providing effective protection and electrical coupling while optimizing package size.

Implementation Method 1

a shield interconnect coupling the shield to the first shielding terminal of the conductive structure

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11967565B2Semiconductor devices including conductive structure and shielding layer and methods of manufacturing semiconductor devices

Publication Date: 2024.04.23 AMKOR TECH JAPAN INC

AI summary

In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.