Shielded PCB Coating Structure for EMI Control and Heat Dissipation

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Solution Overview

Problem

Current electrical connectors in portable electronic devices allow moisture ingress, leading to corrosion and oxidation, and the installation of metal covers for electromagnetic interference and heat dissipation increases device thickness, contradicting the trend of miniaturization and increasing manufacturing costs.

Innovation Solution

A circuit board structure with copper foil layers, water-based environmentally friendly paints forming insulating and conductive layers, and through holes to guide electromagnetic interference and heat to the ground plane, eliminating the need for a metal cover.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a metal cover is installed on the circuit board to shield electromagnetic waves and dissipate heat, then electromagnetic wave shielding and heat dissipation are improved, but the overall thickness of the electronic device increases and manufacturing cost increases

Engineering Contradiction:

Improveelectromagnetic wave shieldingVSAvoiddevice thickness

Core Design Contradiction:

Object-affected harmful factorsVSLength of stationary object

Solution Approach 1:

The patent combines electromagnetic shielding, heat dissipation, and waterproofing functions into a single integrated circuit board structure. The copper foil layer provides electromagnetic shielding, the heat dissipation layer transfers heat, and the waterproof coating prevents moisture ingress, eliminating the need for separate metal cover components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The circuit board is designed to perform multiple functions simultaneously: it serves as the structural base, electromagnetic shielding layer (via copper foil), heat dissipation path (via heat dissipation layer), and waterproof barrier (via coating layer), making it a multi-functional component that replaces traditional separate shielding structures.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Object-affected harmful factors

Engineering Contradiction:

Improveelectromagnetic wave shieldingVSAvoidmanufacturing cost

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The circuit board structure provides its own electromagnetic shielding, heat dissipation, and waterproofing capabilities through integrated layers, making it self-sufficient and eliminating the need for additional separate components that would require separate manufacturing and assembly processes.

Inventive Principle:

Principle #25Self-service

3Use of energy by moving object

If traditional electrical connectors are used with interlocking and clamping methods, then power transmission is achieved, but gaps form between base block and terminals allowing moisture penetration

Engineering Contradiction:

Improvepower transmissionVSAvoidwaterproofness

Core Design Contradiction:

Use of energy by moving objectVSReliability

Solution Approach 1:

The patent extracts and eliminates the gap problem from traditional connector designs by using a waterproof coating layer that covers the entire connector assembly, sealing the interface between base block and terminals to prevent moisture penetration while maintaining electrical connectivity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The waterproof coating layer acts as an intermediary substance that fills and seals the gaps between the base block and terminals, preventing moisture from penetrating into the connector while allowing electrical signals to pass through the conductive paths.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure provides effective waterproofing, electromagnetic interference shielding, and heat dissipation while maintaining device miniaturization and reducing production costs.

Implementation Method 1

the conductive layer forms an electrical connection with the copper foil layer inside the circuit board, so that the electromagnetic waves... are guided to the internal ground plane of the circuit board through the conductive layer for elimination

Methodology Applied

Scientific EffectElectromagnetic wave conduction: Conduction (electrical)

Implementation Method 2

The heat energy can be guided and dispersed on the surface of the first and second insulating layers for rapid dissipation

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS12621938B2Circuit board structure with shielding and heat dissipation functions, and manufacturing method therefor

Publication Date: 2026.05.05 SU HSIEN-CHIANG

AI summary

The present invention provides a circuit board structure and manufacturing method thereof. Select a processing area for electronic components on a circuit board containing a copper foil layer, and calculate marking points without setting the electronic components. Spray water-based environmentally friendly paint on the circuit board to form a first insulating layer. Cut the circuit board outside the marking points to form through holes, and spray water-based environmentally friendly conductive paint on the first insulating layer to form a conductive layer that forms an electrical connection with the copper foil layer. Finally, spray water-based environmentally friendly paint on the conductive layer to form a second insulating layer, so that electromagnetic waves and other interference of the electronic components are guided to the internal ground plane of the circuit board through the conductive layer for elimination, and heat is dispersed on the first and second insulating layers.