Shielded PCB Heat Transfer Layer for Electronic Component Cooling
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Solution Overview
Problem
Electronic devices generate heat during operation, which can degrade performance and cause damage if not managed effectively.
Innovation Solution
Incorporation of a heat transfer portion within the electronic device, comprising a first base layer, a coating layer chemically bonded to a heat dissipating material, and a second base layer, to facilitate heat exchange and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat transfer portion is added to manage heat, then thermal management performance is improved, but device complexity increases
Solution Approach 1:
The heat transfer portion is integrated with the electronic component and shielding portion, combining multiple functions into a single structure. The heat transfer portion includes a base layer, coating layer, heat dissipating material, and second base layer, where the coating layer chemically bonds to both the base layers and heat dissipating material, creating a unified multi-functional component that reduces overall device complexity while improving thermal management.
Solution Approach 2:
The heat transfer portion uses composite material construction with a coating layer that chemically bonds to both the first and second base layers as well as to the heat dissipating material. This composite structure provides enhanced thermal conductivity and chemical stability, improving heat dissipation efficiency while maintaining structural integrity without requiring separate components.
2Reliability
If heat dissipating material is chemically bonded to coating layer, then heat transfer efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The coating layer serves as an intermediary substance that chemically bonds to both the base layers and the heat dissipating material. This intermediary coating facilitates strong chemical bonding between dissimilar materials, ensuring efficient heat transfer while providing a controlled manufacturing process where the coating is applied first, followed by the heat dissipating material, and finally the second base layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management, optimizing device performance and extending lifespan by effectively managing heat accumulation.
Implementation Method 1
a heat transfer portion disposed between the electronic component and the shielding sheet and configured to exchange heat with the electronic component
Implementation Method 2
heat transfer portion...configured to exchange heat with the electronic component
Implementation Method 3
a coating layer disposed on the first base layer, a heat dissipating material disposed on the coating layer and chemically bonded to the coating layer
Data Source
AI summary
An electronic device may include: a housing and a board assembly disposed inside the housing. The board assembly may include a printed circuit board having a first surface and a second surface, an electronic component disposed on the first surface of the board assembly, a shielding portion disposed on the first surface and surrounding the electronic component, the shielding portion including a first support portion forming a receiving space and a shielding sheet covering the receiving space, and a heat transfer portion disposed between the electronic component and the shielding sheet and configured to exchange heat with the electronic component, wherein the heat transfer portion may include a first base layer disposed on the electronic component, a coating layer disposed on the first base layer, a heat dissipating material disposed on the coating layer and chemically bonded to the coating layer, and a second base layer disposed on the heat dissipating material.