Shielded Printed Wiring Board with Segmented Protective Layer
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Solution Overview
Problem
In existing shielded printed wiring boards, the arrangement of openings in the insulating film filled with conductive adhesive is unclear, leading to potential leakage of electromagnetic waves from the signal wiring pattern through the lateral side.
Innovation Solution
A printed wiring board design featuring a base film with a conductor pattern, a protective layer with strategically arranged openings, a conductive adhesive layer filling these openings, and a conductor film, where the spacing between adjacent openings is equal to or smaller than half the wavelength of the electromagnetic wave, preventing wave leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the protective layer is formed with openings filled with conductive adhesive layer, then electromagnetic wave shielding is improved, but electromagnetic waves may leak out from the lateral side through the insulating film
Solution Approach 1:
The protective layer is segmented into multiple sections with openings arranged in rows, creating a patterned structure that blocks electromagnetic waves while maintaining signal transmission capability. The segmented opening arrangement prevents lateral leakage while preserving shielding effectiveness.
Solution Approach 2:
The openings are strategically positioned at specific locations on the ground patterns, creating local variations in the protective layer structure. This local quality variation allows the structure to selectively block electromagnetic waves in certain directions while maintaining transparency to signals in other directions.
2Object-generated harmful factors
If the spacing between adjacent openings is reduced to half wavelength or less, then electromagnetic wave leakage is prevented, but manufacturing precision requirements increase
Solution Approach 1:
The opening spacing parameter is specifically controlled to be equal to or less than half the wavelength of the electromagnetic waves to be shielded. This parameter change creates a physical barrier that blocks wave propagation while the patent provides guidance on selecting appropriate spacing values based on the application requirements.
3Object-affected harmful factors
If multiple rows of openings are arranged along the first direction, then electromagnetic wave blocking is improved, but the complexity of the protective layer structure increases
Solution Approach 1:
The protective layer is divided into multiple rows of openings arranged along the first direction, creating a segmented pattern that systematically blocks electromagnetic waves. This segmentation approach provides effective shielding while maintaining a regular, repeatable structure that simplifies manufacturing.
Solution Approach 2:
The repetitive opening pattern serves multiple functions simultaneously: it blocks electromagnetic waves, maintains signal transmission paths, and provides structural consistency across the protective layer. The universal pattern design simplifies manufacturing while achieving multiple shielding objectives.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents electromagnetic waves from leaking out laterally through the protective layer, ensuring improved electromagnetic interference (EMI) shielding.
Implementation Method 1
The conductive adhesive layer includes a portion disposed on the protective layer, a portion disposed inside each of the plurality of first openings, and a portion disposed inside each of the plurality of second openings... A spacing between two adjacent openings of the plurality of first openings or a spacing between two adjacent openings of the plurality of second openings are equal to or smaller than one half of a wavelength of an electromagnetic wave
Data Source
AI summary
The printed wiring board includes a base film, a first conductor pattern, a protective layer, a conductive adhesive layer, and a conductor film. The base film has a first main surface. The first conductor pattern is disposed on the first main surface. The first conductor pattern includes a signal pattern, a first ground pattern, and a second ground pattern, each of which extends along a first direction in a planar view. The signal pattern is disposed between the first ground pattern and the second ground pattern in a second direction orthogonal to the first direction. The protective layer is disposed on the first main surface so as to cover the first conductor pattern.