Shielded PCB Lamination With Through-Hole Conductive Structures
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Solution Overview
Problem
Existing methods for shielding circuit board signal wires from electromagnetic interference require high accuracy processes, which are not adequately addressed.
Innovation Solution
A method involving the formation of conductive structures within through holes in the circuit board layers, connecting the wiring layers to shielding layers, thereby protecting them from electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If at least one shielding layer is pressed on the wiring layer to protect signals from electromagnetic interference, then electromagnetic interference protection is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements a nested structure where the shielding layer is positioned between two wiring layers, with conductive structures embedded within through holes of the insulating base. This nesting arrangement allows the shielding layer to be integrated within the multi-layer board structure rather than merely pressed on the surface, providing electromagnetic interference protection while maintaining alignment through the inherent structural integration of the laminated construction
Solution Approach 2:
The conductive structures are formed within the through holes of the insulating base before the final lamination process. This preliminary formation of conductive pathways ensures that alignment features are established in advance, reducing the alignment tolerance requirements during subsequent pressing operations while maintaining effective electrical connection between shielding layers and wiring layers
2Object-affected harmful factors
If multiple shielding layers with conductive connections are used to sandwich wiring layers, then electromagnetic interference protection is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into integrated structures: the insulating base serves as both the structural support and the medium containing conductive structures; the conductive structures simultaneously provide electrical connection between shielding layers and act as alignment references; the through holes serve as both conductive pathways and positioning features. This merging of functions reduces the number of separate manufacturing steps and components, simplifying the overall manufacturing process while maintaining effective electromagnetic interference protection
Solution Approach 2:
The conductive structures embedded in the through holes perform multiple functions: they provide electrical connection between adjacent shielding layers, serve as alignment references for layer registration, and maintain structural integrity of the laminated assembly. This multi-functionality reduces the need for separate alignment features and connection elements, thereby reducing manufacturing process complexity while achieving effective electromagnetic shielding
Data Source
AI summary
A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.