3D Printed Shielded PCB Tracks for EMI Reduction
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Solution Overview
Problem
Current methods for mitigating crosstalk and electromagnetic interference (EMI) in high-density, high-speed printed circuit boards (PCBs) are costly, complex, and limited by material constraints, leading to reduced design efficiency, increased size, and compromised integrity due to the use of extensive vias and inadequate shielding solutions.
Innovation Solution
The method involves direct and continuous 3D printing of insulation-jacketed tracks and components with metallic shielding sleeves or capsules using inkjet printing, employing a system with insulating resin and metallic inkjet inks, controlled by a computer-aided manufacturing module to form electromagnetically-shielded tracks and components, allowing for optimized PCB design with reduced physical distance between components and increased shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional EMI shielding methods (metal housings, plating, painting) are used, then electromagnetic interference is reduced, but manufacturing cost increases and process complexity increases
Solution Approach 1:
The patent replaces conventional mechanical EMI shielding methods (metal housings, plating, painting) with a digital printing system that deposits conductive and insulating materials layer-by-layer. The printing system includes a digital printer, material reservoirs, and computer-controlled deposition, substituting complex mechanical manufacturing processes with a programmable digital system that reduces process complexity while maintaining EMI shielding effectiveness.
Solution Approach 2:
The patent uses composite material structures consisting of conductive material layers (for EMI shielding) and insulating material layers (for electrical isolation) deposited in alternating patterns. This composite approach allows simultaneous achievement of EMI shielding and electrical insulation functions within a single integrated structure, reducing the need for separate shielding components and simplifying the overall manufacturing process.
2Object-affected harmful factors
If conventional EMI shielding methods (metal housings, plating, painting) are used, then electromagnetic interference is reduced, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive conventional EMI shielding methods (metal housing fabrication, electroplating, chemical painting) with a digital printing process that deposits conductive materials directly onto the circuit board substrate. This substitution eliminates the need for separate shielding components and complex assembly processes, significantly reducing manufacturing costs while maintaining effective EMI shielding.
Solution Approach 2:
The patent merges the EMI shielding function with the circuit board manufacturing process itself. By depositing conductive and insulating material layers directly during board fabrication, the shielding structure is integrated into the board rather than being added as a separate component. This merging eliminates additional manufacturing steps, reduces assembly costs, and simplifies the overall production process.
3Object-affected harmful factors
If extensive vias and ground connectors are used for shielding, then EMI is reduced, but PCB design efficiency decreases and size increases
Solution Approach 1:
The patent extracts the EMI shielding function from the traditional via and ground connector infrastructure. Instead of relying on extensive via networks and dedicated ground connectors for shielding, the patent deposits continuous conductive material layers that provide EMI shielding independently. This extraction allows designers to achieve effective shielding without being constrained by via placement requirements, significantly improving PCB design efficiency and reducing board complexity.
Solution Approach 2:
The patent transitions EMI shielding from a two-dimensional via-based approach to a three-dimensional layered structure. By depositing conductive and insulating material layers in multiple thicknesses and patterns, the patent creates volumetric shielding that is more effective than planar via structures. This dimensional change provides superior EMI protection while requiring fewer vias and ground connectors, thereby improving design efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances signal integrity by minimizing crosstalk, enabling higher data transmission rates and density while reducing the need for ground connectors and vias, thus improving PCB design efficiency and reducing costs.
Implementation Method 1
direct printing of circuit boards having an electromagnetically-shielded tracks and/or components
Data Source
AI summary
The disclosure relates to methods and compositions for direct printing of circuit boards having an electromagnetically-shielded tracks and/or components. Specifically, the disclosure relates to the direct, uninterrupted and continuous 3D printing of insulation-jacketed tracks and/or components with metallic shielding sleeves or capsule.