Shielded Power Module Structure for EMI and Heat Dissipation
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Solution Overview
Problem
Power modules experience electromagnetic interference that can cause device interference, communication errors, and system faults, necessitating effective electromagnetic shielding.
Innovation Solution
A power module design incorporating a thermally conductive member, substrate, chip, pins, and a shielding member with an equipotential body formed by the shielding member, which redistributes electrons to counteract electromagnetic waves, providing both internal and external shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electromagnetic shielding is added to the power module, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The patent combines the shielding member with the thermally conductive member into an integrated structure. The shielding member is disposed on the thermally conductive member, and both members work together to provide both thermal management and electromagnetic shielding functions simultaneously, reducing the need for separate components and simplifying the overall device structure.
Solution Approach 2:
The thermally conductive member serves dual purposes: it acts as both a heat dissipation component and a structural support for the shielding member. This multi-functional design allows the power module to achieve electromagnetic shielding without adding excessive complexity, as the same structural elements perform multiple functions.
2Object-affected harmful factors
If a shielding member is added to the power module, then electromagnetic shielding capability is improved, but manufacturing complexity increases
Solution Approach 1:
The shielding member is pre-formed with a specific shape that matches the contours of the thermally conductive member and power module components. This preliminary shaping allows the shielding member to be easily positioned and fastened during assembly, reducing manufacturing complexity. The shielding member's design includes features that facilitate easy integration into the existing power module structure.
3Object-affected harmful factors
If the shielding member accommodates the chip and substrate, then electromagnetic shielding is enhanced, but volume of the power module increases
Solution Approach 1:
The shielding member is designed to nest over the thermally conductive member, substrate, and chip assembly. The accommodating space is formed by the spatial relationship between the shielding member and thermally conductive member, allowing the chip and substrate to be positioned within this space. This nested configuration provides electromagnetic shielding without requiring significant additional volume, as the shielding member utilizes the existing vertical space in the power module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation, securely fastens components, and improves electromagnetic shielding, ensuring stable and reliable operation with minimal impact on external components.
Implementation Method 1
the shielding member has a shielding capability, and the shielding member can conduct electricity, so that an equipotential body can be formed. The equipotential body can keep a surface of the power module at a same electric potential, thereby implementing effect of electromagnetic shielding between the outside and the inside of the power module. When an external electromagnetic wave is incident on a surface of the equipotential body, free electrons on the surface of the equipotential body with a same electric potential are redistributed, to generate an electric field with a same size as but in an opposite direction to the incident wave. Such a reverse electric field offsets an electric field of the incident wave, thereby reducing or preventing penetration of the electromagnetic wave and forming electromagnetic shielding.
Implementation Method 2
the thermally conductive member is disposed, so that the power module has a relatively good heat dissipation capability
Data Source
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AI summary
This application provides a power module and a power converter. The power module includes a thermally conductive member, a chip, a plurality of pins, and a shielding member. The shielding member is disposed on a side that is of the thermally conductive member and that is close to the chip, accommodating space is formed between the shielding member and the thermally conductive member, the chip and the substrate are located in the accommodating space, and the other end of each of the plurality of pins is exposed relative to the shielding member. In this application, the thermally conductive member is disposed, so that the power module has a relatively good heat dissipation capability. The shielding member is disposed, and the shielding member and the thermally conductive member are fastened, so that components such as the chip and the substrate can be better fastened and accommodated, electromagnetic shielding can be performed on the chip and/or the substrate as a whole, and shielding effect of the power module is improved. In this way, the power module can shield electromagnetic interference from the outside and shield electromagnetic interference from the inside of the power module to the outside, so that the power module has relatively stable and reliable operating performance, and has relatively small impact on another external electronic component.