Shielded Redistribution Structure for High-Frequency Microfeature Dies
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing redistribution structures (RDS) in microelectronic devices suffer from line interference due to signal leakage, distortion, and electromagnetic interference, limiting high-performance operations.
Innovation Solution
A redistribution structure with a conductive shield surrounding conductive lines to reduce electromagnetic interference, allowing closer line spacing and independent impedance control, and enabling high-frequency signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional redistribution structures with unshielded lines and vias are used, then the device complexity is low and manufacturing is easier, but electromagnetic interference causes signal leakage and distortion limiting high-frequency operation
Solution Approach 1:
A conductive shield layer is introduced as an intermediary element between signal lines to block electromagnetic interference. The shield acts as a mediator that prevents direct electromagnetic coupling between adjacent lines, reducing crosstalk and signal distortion while maintaining reasonable structural complexity
Solution Approach 2:
The redistribution structure employs composite material architecture combining conductive shield layers with insulating layers. This composite approach integrates electromagnetic shielding functionality with signal transmission pathways, achieving both EMI protection and signal integrity without excessive complexity increase
2Object-affected harmful factors
If lines are spaced farther apart to reduce interference, then electromagnetic interference is reduced, but the area occupied by the redistribution structure increases
Solution Approach 1:
The conductive shield serves as an intermediary that enables closer line spacing by blocking electromagnetic fields. Lines can be positioned nearer together because the shield prevents direct electromagnetic coupling, thus reducing the overall area while maintaining low interference levels
Solution Approach 2:
Thin conductive shield films are used to provide electromagnetic protection without adding significant volume. The shield layers are implemented as thin films that conform to the routing requirements, enabling compact area utilization while maintaining interference protection
3Speed
If high-frequency signals are transmitted through conventional lines, then device performance is improved, but signal leakage and distortion occur due to electromagnetic interference
Solution Approach 1:
The conductive shield acts as a mediator that confines electromagnetic fields around signal lines, preventing energy leakage at high frequencies. This enables high-speed signal transmission by maintaining signal integrity through electromagnetic field containment
Solution Approach 2:
The shield structure provides preliminary anti-action by preemptively blocking electromagnetic interference before it can affect signal transmission. The shield is positioned to prevent both outgoing signal leakage and incoming interference, ensuring clean high-frequency operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive shield mitigates electromagnetic interference, enabling high-frequency signal transmission and reduced line spacing, enhancing device performance.
Implementation Method 1
A redistribution structure with a conductive shield surrounding conductive lines to reduce electromagnetic interference
Data Source
Figure 1A~1B
Figure 2A
Figure 2B
AI summary
Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate (120) having a bond site (124) and integrated circuitry (123) electrically connected to the bond site. The microfeature dies can also include and a redistribution structure (122) coupled to the substrate. The redistribution structure can include an external contact (126) site configured to receive an electric coupler, a conductive line (128) that is electrically connected to the external contact site and the bond site, and a conductive shield (136, 142) that at least partially surrounds the conductive line.