Shielded Semiconductor Package Layout for Compact Reliable Integration
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The proposed solution involves a semiconductor device design with a substrate, electronic components, an encapsulant, and a conformal shield, where the encapsulant contacts lateral sides of the components and the conformal shield defines compartments to optimize packaging efficiency and performance, including the use of a substrate with conductive and dielectric structures and a communication structure coupled with the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are used, then manufacturing is simpler, but package size becomes too large and cost increases
Solution Approach 1:
The patent implements nesting by placing multiple electronic components (ICs, capacitors, resistors) within a single package body, with components arranged in overlapping or nested configurations. The encapsulant material surrounds and protects these nested components, achieving compact packaging while maintaining manufacturing feasibility through established encapsulation processes.
Solution Approach 2:
The patent transitions from planar component arrangement to three-dimensional spatial utilization by stacking components vertically and using the encapsulant to fill and protect the multi-layer structure. This dimensional transition reduces the horizontal footprint while managing manufacturing complexity through controlled molding processes.
2Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but reliability decreases
Solution Approach 1:
The patent employs an encapsulant material forming a protective shell around all electronic components. This encapsulant layer provides environmental protection (moisture, contamination resistance) and mechanical support, enhancing reliability while the encapsulation process itself remains a standard manufacturing technique that doesn't significantly increase complexity.
Solution Approach 2:
The patent utilizes composite material structures combining different materials with complementary properties: conductive materials for electrical connections, dielectric materials for insulation, and encapsulant materials for protection. This composite approach improves reliability by addressing multiple requirements simultaneously without proportionally increasing manufacturing complexity.
3Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but performance is relatively low
Solution Approach 1:
The patent applies local quality by providing different material properties and structural characteristics in different regions of the package: conductive pathways in specific areas for electrical connectivity, dielectric regions for insulation, and encapsulated zones for component protection. This localized optimization enhances overall device performance while using standard manufacturing processes applied with regional variations.
Data Source
AI summary
In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.