Shielded Semiconductor Packages With Open Terminals
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Solution Overview
Problem
Traditional semiconductor package shielding methods completely cover the top of the package, causing short circuits with exposed terminals or sockets, which are necessary for connection to adjacent devices, thus failing to provide both electromagnetic interference (EMI) shielding and exposed terminals simultaneously.
Innovation Solution
A two-step partial shielding removal process is employed, where a conductive shielding layer is formed over the semiconductor package, and then selectively removed using laser ablation or other methods to expose terminals while maintaining shielding on all other surfaces, ensuring EMI protection without short-circuiting exposed terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductive shielding layer is formed over the semiconductor package to provide EMI protection, then electromagnetic interference shielding is improved, but the terminals become short-circuited and cannot be exposed for connection
Solution Approach 1:
The patent applies local quality by forming a non-conductive opening in the shielding layer at the terminal region, allowing the terminals to remain exposed and accessible while the rest of the package maintains continuous EMI shielding. This creates different functional properties in different locations: conductive shielding over most surfaces and non-conductive opening at terminal areas.
Solution Approach 2:
The shielding layer is segmented into two distinct regions: a conductive portion that provides EMI shielding and a non-conductive opening that exposes the terminals. This segmentation allows the shielding structure to simultaneously provide both protection and accessibility without compromising either function.
2Object-affected harmful factors
If the shielding layer completely covers the package top surface, then EMI protection is maximized, but connection to adjacent devices becomes impossible due to short-circuited terminals
Solution Approach 1:
The patent creates local quality differentiation by maintaining continuous conductive shielding over most of the package surface while introducing a specific non-conductive opening at the terminal location, enabling both EMI protection and device interconnection functions to coexist.
Solution Approach 2:
The shielding layer is divided into conductive and non-conductive segments, where the conductive segment provides EMI protection and the non-conductive segment at the terminal region enables electrical connection to adjacent devices without short-circuiting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for effective EMI shielding while keeping terminals exposed for interconnection, preventing interference and enabling secure electrical connections, thus addressing the need for both shielding and accessible terminals in semiconductor devices.
Implementation Method 1
Conductive layers are commonly formed over semiconductor packages to shield electronic parts within the package from EMI and other interference. Shielding layers absorb EMI before the signals can hit semiconductor die and discrete components within the package
Implementation Method 2
A two-step partial shielding removal process is employed, where a conductive shielding layer is formed over the semiconductor package, and then selectively removed using laser ablation or other methods to expose terminals
Data Source
AI summary
A semiconductor device has a substrate including a terminal and an insulating layer formed over the terminal. An electrical component is disposed over the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the insulating layer over the terminal is exposed from the encapsulant. A shielding layer is formed over the encapsulant and terminal. A portion of the shielding layer is removed to expose the portion of the insulating layer. The portion of the insulating layer is removed to expose the terminal. The portion of the shielding layer and the portion of the insulating layer can be removed by laser ablation.