Shielded Insulating Shell Structure for Creepage Path Insulation
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Solution Overview
Problem
Traditional solid state transformer (SST) systems face complexity and inefficiency due to separate insulation designs for phase-to-phase, shell-to-shell, and high to low voltage module insulation, leading to increased component count, weight, and electrical field stress, with existing shielded insulating shells having low partial discharge resistance and poor electrical performance.
Innovation Solution
A shielded insulating shell with a structured assembly including inner and outer shielding layers, insulating layers, and air gap layers forming a creepage path, which reduces electrical field stress and enhances insulation efficiency by increasing the creepage distance and spacing between high and low voltage shielding layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate insulation designs are used for phase-to-phase, shell-to-shell, and high to low voltage module insulation, then insulation requirements are met, but the number of components increases and system complexity increases
Solution Approach 1:
The patent combines multiple insulation functions (phase-to-phase insulation, shell-to-shell insulation, and high-to-low voltage insulation) into a single integrated insulating shell structure. This unified design eliminates the need for separate insulation components for each function, thereby reducing the total number of components and simplifying the overall system while maintaining all required insulation performance levels.
Solution Approach 2:
The insulating shell is designed to perform multiple insulation functions simultaneously - providing phase-to-phase insulation, shell-to-shell insulation, and high-to-low voltage insulation all through one structure. This multi-functional design allows a single component to satisfy multiple insulation requirements that would traditionally require separate dedicated components for each function.
2Device complexity
If integrated cylinder insulating shell or detachable embedded mesh insulating shell is used, then system complexity is reduced, but installation and operation space is confined and positioning fixtures are required
Solution Approach 1:
The insulating shell is divided into multiple detachable sections or modules that can be assembled incrementally around the high voltage module. This segmentation allows the shell to be installed in a step-by-step manner without requiring complex positioning fixtures, as each section can be independently positioned and secured, thereby improving installation ease while maintaining structural integrity.
3Device complexity
If air gap is disposed outside the high and low voltage shielding layers, then structure is simplified, but electric field stress is concentrated and partial discharge resistance is low
Solution Approach 1:
The patent introduces an intermediary insulating layer positioned between the high voltage and low voltage shielding layers, which acts as a mediator to distribute the electric field stress. This intermediate insulating structure prevents direct concentration of electric field stress at the interface between shielding layers, thereby enhancing partial discharge resistance while maintaining a relatively simple overall structure through the use of standard layered construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the shell structure, reduces the number of components, increases the creepage distance, and improves partial discharge resistance and electrical performance by distributing the electric field more uniformly, thereby enhancing the overall insulation efficiency and reliability of the SST system.
Implementation Method 1
an assembling gap formed on the first structure, which cooperates with the first air gap layer to form a creepage path on the first structure that extends from the inner shielding layer to the outer shielding layer
Implementation Method 2
a first structure formed on the first cavity, and formed by assembling to include at least a first shielding layer, a first insulating layer, a first air gap layer, a second insulating layer, and a second shielding layer arranged sequentially from an inner side to an outer side of the first cavity
Data Source
Figure 1
Figure 2A
Figure 2B~2C
AI summary
The present disclosure discloses a shielded insulating shell (100) and an electronic device. The shielded insulating shell (100) includes a shell body (SB) provided with a first cavity (R1), with an inner shielding layer (IS) near the first cavity (R1) and an outer shielding layer (OS) far away from the first cavity (R1) being formed on the shell body (SB); a first structure (ST1) formed on the first cavity (R1), and formed by assembling to comprise at least a first shielding layer, a first insulating layer, a first air gap layer, a second insulating layer, and a second shielding layer arranged sequentially from an inner side to an outer side of the first cavity (R1); and an assembling gap (AG) formed on the first structure (ST1), which cooperates with the first air gap layer to form a creepage path on the first structure (ST1) that extends from the inner shielding layer (IS) to the outer shielding layer (OS).