Substrate Structure With Shielded Through Holes For Signal Routing
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Solution Overview
Problem
In endoscopes, the compact relay substrate configuration requires efficient placement of signal wires between closely spaced substrates, necessitating skilled techniques to prevent electrical contact and interference while maintaining high-density mounting and electromagnetic shielding.
Innovation Solution
A substrate structure with a first substrate, a second substrate, a substrate spacing holding member, a mounted signal wire projecting from the second substrate, and a through hole in the first substrate covered by a shielding member to prevent electrical interference and allow for precise signal wire placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the spacing between substrates is reduced to achieve compact relay substrate configuration, then the substrate size is reduced, but it becomes difficult to dispose signal wires without electrical contact and interference
Solution Approach 1:
The space between substrates is segmented into distinct regions: a first region for signal wire passage and a second region for component mounting. This segmentation allows signal wires to be systematically routed through the first region while components are mounted in the second region, preventing electrical contact and interference even in reduced spacing configurations.
Solution Approach 2:
A spacing holding member is introduced as an intermediary component between the first and second substrates. This member not only maintains the reduced spacing but also provides structured pathways (through holes) that guide and isolate signal wires, preventing direct contact between wires and substrates while enabling compact configuration.
2Volume of moving object
If high-density mounting is implemented to reduce substrate spacing, then the relay substrate size is reduced, but electromagnetic shielding becomes more difficult to ensure
Solution Approach 1:
The substrate structure is segmented into distinct functional regions with through holes providing isolated pathways for signal wires. This segmentation creates electromagnetic isolation zones that prevent interference between adjacent signal wires and between wires and substrates, enabling high-density mounting while maintaining shielding effectiveness.
Solution Approach 2:
Electromagnetic shielding is applied locally at critical positions where signal wires pass through the substrates. The spacing holding member with through holes provides localized shielding structures at wire passage points, rather than requiring comprehensive shielding across the entire substrate surface, thus enabling compact design while maintaining necessary electromagnetic protection.
3Productivity
If multiple signal wires are disposed in reduced space, then substrate integration is improved, but skilled techniques are required to prevent electrical contact
Solution Approach 1:
The spacing holding member is pre-configured with through holes at specific positions before substrate assembly. This preliminary arrangement of wire pathways guides signal wires through predetermined safe routes, eliminating the need for complex skilled techniques during assembly while ensuring reliable electrical isolation is maintained throughout the compact structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents physical and electrical interference between signal wires and substrates, enabling high-density mounting and reduced substrate spacing while maintaining electromagnetic shielding, enhancing image quality and reducing signal cable diameters.
Implementation Method 1
a shielding member for electric shielding, the shielding member being provided on a back face side of the first substrate and covering an entirety or at least a part of an opening of the through hole
Data Source
AI summary
A substrate structure includes: a first substrate; a second substrate including a front face disposed so as to face a front face of the first substrate, a substrate spacing holding member provided between the front faces of the substrates facing each other, and holds a spacing between the two substrates at a predetermined value; a mounted component including a signal wire mounted on the second substrate, the signal wire, including an end portion electrically connected to the second substrate and extending from the substrate to an outside along the front face of the second substrate; a through hole provided in the first substrate, the through disposing a projecting part of the mounted component therein; and a shielding member being provided on a back face side of the first substrate and covering an entirety or at least a part of an opening of the through hole.


