Individually Shielded Terminals in Insulating Lumps

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Solution Overview

Problem

High terminal density electrical connectors face challenges in effectively preventing Electromagnetic Interference (EMI) due to surface-mounted metal layers, which reduce signal transmission quality and increase the risk of terminal contact and grounding.

Innovation Solution

An electrical connector design featuring an insulating body with terminal slots and receiving holes, where EMI shielding layers are integrated into the inner walls of the holes and covered with insulating layers to prevent terminal contact, thereby reducing EMI and static electricity, and a variant with insulating lumps and peripheral shielding units that avoid direct contact with terminals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a metal layer is disposed on the surface of the insulating body to prevent EMI, then EMI protection is improved, but the terminals may contact the shielding layer causing grounding and signal transmission degradation

Engineering Contradiction:
ImproveEMI protectionVSAvoidsignal transmission quality
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

An insulating layer is introduced as an intermediary between the terminal and the EMI shielding layer. This insulating layer prevents direct contact between the terminal and shielding layer, eliminating the grounding risk while maintaining the EMI shielding effect. The insulating layer acts as a mediator that allows both EMI protection and reliable signal transmission to coexist.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The shielding structure is segmented into multiple independent shielding layers, each associated with specific terminal-receiving holes rather than a continuous surface layer. This segmentation allows the shielding function to be localized where needed while maintaining insulation between terminals and shielding structures, preventing signal degradation.

Inventive Principle:
Principle #1Segmentation

2Productivity

If high terminal density is implemented to increase data transmission rate, then productivity is improved, but EMI protection becomes more difficult and signal quality deteriorates

Engineering Contradiction:
Improvedata transmission rateVSAvoidEMI interference
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The EMI shielding structure is segmented into individual shielding layers for each terminal-receiving hole or group of holes, rather than using a continuous surface layer. This segmented approach allows effective EMI protection for each terminal while maintaining high terminal density, as the shielding is localized and does not create interference between adjacent terminals.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

EMI shielding is applied locally to specific terminal-receiving holes rather than uniformly across the entire insulating body surface. This local quality approach allows high terminal density in areas where shielding is not needed while providing targeted EMI protection where terminals are present, thus maintaining both high productivity and EMI protection.

Inventive Principle:
Principle #3Local quality

3Device complexity

If surface-mounted metal layers are used for EMI shielding, then device complexity is reduced, but the shielding effectiveness is insufficient for high terminal density connectors

Engineering Contradiction:
Improveshielding structure complexityVSAvoidEMI interference between terminals
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The shielding structure is divided into multiple discrete shielding layers positioned at different locations within the terminal-receiving holes, rather than using a single surface-mounted layer. This segmentation provides enhanced EMI protection for high terminal density connectors while maintaining relatively simple manufacturing processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The EMI shielding approach transitions from a two-dimensional surface-mounted layer to a three-dimensional structure with shielding layers positioned at multiple depths within the terminal-receiving holes. This dimensional change provides superior EMI protection by creating multiple barriers against electromagnetic interference while maintaining structural simplicity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances signal stability by minimizing EMI and preventing terminal grounding, while maintaining a simple structure and reducing costs through effective EMI shielding without direct terminal-shielding contact.

Implementation Method 1

An EMI shielding layer is disposed on the surface defining each terminal shot

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

an insulating layer is correspondingly disposed over each EMI shielding layer

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS8079872B2Individually shielded terminals within insulating lumps
Publication Date: 2011.12.20 LOTES
  • US8079872B2 patent drawing
  • US8079872B2 patent drawing
  • US8079872B2 patent drawing

AI summary

An electrical connector includes an insulating body, a plurality of terminal units, a plurality of insulating lump units, and a plurality of shielding units. The insulating body has a plurality of receiving holes arranged thereon. Each of the insulating lump units has a terminal fixing slot for mounting the corresponding terminal unit there-through. Each of the shielding units is respectively disposed on the periphery of the corresponding insulating lump unit without contacting the terminal unit mounted thereon. The terminals are disposed in the receiving holes of the insulating body. The insulating lump units can prevent shorting between the terminals and the shielding units, while the shielding units can enhance the anti-EMI capability of the instant connector.