Shielded Ultrasound Transducer for EMI Protection
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Solution Overview
Problem
Medical imaging systems employing ultrasound face interference issues due to electromagnetic and radio-frequency emissions, particularly in thermoacoustic imaging where high-energy electromagnetic pulses generate significant electric fields, leading to signal interference and potential damage to electronics.
Innovation Solution
A shielded ultrasound transducer design featuring a shield with acoustic conductivity and electrical attenuation characteristics that reduces a 100 V/cm electric field to below a threshold level, exposing the piezoelectric element to electrical potentials of 10 μV or less, using elastic conductive materials or cage-like structures to minimize interference while preserving acoustic signal amplitude.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional shielding methods are used in ultrasound transducers, then electromagnetic interference protection is provided, but acoustic signal transmission is significantly attenuated
Solution Approach 1:
The patent applies local quality by using different materials for different parts of the shielding structure. The housing uses a non-conductive material (plastic or ceramic) while the shield uses a conductive material (metal or conductive polymer). This localized differentiation allows the non-conductive housing to transmit acoustic signals while the conductive shield provides EMI protection, resolving the contradiction between shielding effectiveness and acoustic transmission.
Solution Approach 2:
The patent employs composite materials by combining conductive and non-conductive materials in a single transducer assembly. The housing is made of non-conductive material for acoustic transparency, while the shield is made of conductive material for EMI protection. This composite approach allows each material to perform its optimal function without compromising the other, simultaneously achieving both acoustic signal transmission and electromagnetic interference protection.
2Loss of energy
If no shielding is used to maintain acoustic signal transmission, then acoustic signals pass through freely, but electromagnetic and radio-frequency interference damage electronics and cause imaging inaccuracies
Solution Approach 1:
The patent applies local quality by using different materials for different parts of the shielding structure. The housing uses a non-conductive material (plastic or ceramic) while the shield uses a conductive material (metal or conductive polymer). This localized differentiation allows the non-conductive housing to transmit acoustic signals while the conductive shield provides EMI protection, resolving the contradiction between shielding effectiveness and acoustic transmission.
Solution Approach 2:
The patent employs composite materials by combining conductive and non-conductive materials in a single transducer assembly. The housing is made of non-conductive material for acoustic transparency, while the shield is made of conductive material for EMI protection. This composite approach allows each material to perform its optimal function without compromising the other, simultaneously achieving both acoustic signal transmission and electromagnetic interference protection.
3Object-affected harmful factors
If thicker shielding material is used to block electromagnetic interference, then EMI protection is improved, but acoustic signal attenuation increases
Solution Approach 1:
The patent applies local quality by using different materials for different parts of the shielding structure. The housing uses a non-conductive material (plastic or ceramic) while the shield uses a conductive material (metal or conductive polymer). This localized differentiation allows the non-conductive housing to transmit acoustic signals while the conductive shield provides EMI protection, resolving the contradiction between shielding effectiveness and acoustic transmission.
Solution Approach 2:
The patent employs composite materials by combining conductive and non-conductive materials in a single transducer assembly. The housing is made of non-conductive material for acoustic transparency, while the shield is made of conductive material for EMI protection. This composite approach allows each material to perform its optimal function without compromising the other, simultaneously achieving both acoustic signal transmission and electromagnetic interference protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively shields the ultrasound transducer from electromagnetic and radio-frequency interference, preventing signal interference and potential damage, while maintaining minimal acoustic signal attenuation, ensuring accurate imaging in high EMI and RFI environments.
Implementation Method 1
the shield having acoustic conductivity and electrical attenuation characteristics that enable the acoustic signals to propagate therethrough while reducing a 100 volt per centimeter electric field to below a threshold level
Implementation Method 2
at least one piezoelectric element configured to convert received acoustic signals into an electric potential
Implementation Method 3
enable the acoustic signals to propagate therethrough
Data Source
AI summary
An ultrasound transducer with at least one piezoelectric element configured to convert received acoustic signals into an electric potential, a shield connectable to ground and overlying the at least one piezoelectric element through which the acoustic signals pass before being received by the at least one piezoelectric element, the shield having acoustic conductivity and electrical attenuation characteristics that enable the acoustic signals to propagate therethrough while reducing a 100 volt per centimeter electric field to below a threshold level so that the piezoelectric element is exposed to a threshold electrical potential at least less than or equal to 10 μV, and a housing accommodating the at least one piezoelectric element and shield.


