Shielded Wafer Connector Assembly for High-Density Data Links

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Solution Overview

Problem

Designing connectors for high data rate applications with high conductor density and small footprint while maintaining electrical integrity is challenging, particularly in backplane systems.

Innovation Solution

A connector assembly featuring a plug mating interface, surface mating interface, and wafer assembly with conductive gaskets and shield covers to provide additional shielding for signal conductors, using conductive elastomeric gaskets and plated plastic components to enhance electromagnetic interference protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conductor density is increased to achieve high data rates, then data throughput capability is improved, but electromagnetic interference and crosstalk between adjacent conductors increases

Engineering Contradiction:
Improvedata throughput capabilityVSAvoidelectromagnetic interference and crosstalk
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

A conductive gasket is introduced as an intermediary shielding element positioned between adjacent signal conductors and differential pairs. The gasket, made of conductive elastomeric material, acts as a mediator that blocks electromagnetic fields from coupling between neighboring conductors, thereby reducing crosstalk while allowing the high conductor density configuration to be maintained for high data throughput

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The conductive gasket is implemented as a flexible thin film component that can conform to the connector geometry. This flexible shielding film is positioned between differential pairs and signal conductors, providing electromagnetic interference protection while accommodating the compact high-density conductor arrangement necessary for high data rate applications

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If additional shielding components are added to reduce electromagnetic interference, then signal integrity is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvesignal integrityVSAvoidconnector structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The shield cover is implemented as a flexible conductive shell that can conform to the connector housing geometry. This flexible shielding component provides electromagnetic interference protection for the conductive gasket and internal conductors while being easier to manufacture and assemble than rigid shield structures, thereby improving signal integrity without excessively increasing device complexity

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The conductive gasket is made from composite elastomeric material that combines electrical conductivity with flexibility and conformability. This composite material allows the gasket to serve as both a structural element and an electromagnetic shield, improving signal integrity while avoiding the need for separate rigid shield components that would increase manufacturing complexity

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances signal integrity and facilitates higher data throughput by reducing crosstalk and electromagnetic interference, meeting the mechanical and electrical requirements of high data rate applications.

Implementation Method 1

The conductive gasket can be embodied as a conductive elastomeric gasket and provides a conductive shield over open edges of the channel shield

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20260066589A1Connector assembly
Publication Date: 2026.03.05 MOLEX INC
  • US20260066589A1 patent drawing
  • US20260066589A1 patent drawing
  • US20260066589A1 patent drawing

AI summary

Connector assemblies for high speed data communication are described. In one example, a connector assembly includes a plug mating interface, a surface mating interface, and a wafer assembly between the plug mating interface and the surface mating interface. The wafer assembly includes a wafer insert, a channel shield, a plurality of signal conductors extending within the channel shield, a conductive gasket positioned over open edges of the channel shield, and a shield cover positioned over the conductive gasket. The conductive gasket can be embodied as a conductive elastomeric gasket and provides a conductive shield over open edges of the channel shield. The conductive gasket can be positioned between the shield cover and the open edges of the channel shield. The conductive gasket and the shield cover help to enclose open areas in the channel shield and provide additional shielding for the signal conductors.