Shielded Wiring Board Layout for High-Density Noise Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wiring boards face challenges in achieving high-density packaging due to limitations in processing size and positional accuracy of through-holes, leading to increased radiation noise and interference.
Innovation Solution
A wiring board design featuring a shield layer overlapping signal lines with an insulating layer and connection conductor lines connecting the shield layer to ground lines, reducing radiation noise while allowing for high-density wiring layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield layer is provided on one side of signal lines via an insulating layer with through-holes to connect ground layers, then radiation noise is reduced, but the processing size and positional accuracy of through-holes are limited, restricting higher density wiring
Solution Approach 1:
The invention extracts the connection function from traditional through-holes and relocates it to end portions of the insulating layer. By removing the need for through-holes and replacing them with end portions that extend beyond the insulating layer boundary, the design eliminates the manufacturing precision constraints associated with through-hole positioning while maintaining the ground connection function.
Solution Approach 2:
The invention transitions from a two-dimensional through-hole connection (piercing through the insulating layer) to a three-dimensional end portion structure that extends beyond the insulating layer boundary. This dimensional change allows the connection conductor line to make contact with the ground layer without requiring precise through-hole positioning, thereby enabling higher density wiring.
2Object-affected harmful factors
If through-holes are used to electrically connect the shield layer to the ground layer, then radiation noise is reduced, but the processing size of through-holes limits higher density packaging
Solution Approach 1:
The invention extracts the connection function from through-holes and implements it through end portions of the insulating layer. This extraction eliminates the need for large through-hole processing while maintaining the essential ground connection function, thereby reducing the area occupied by connection structures and enabling higher density packaging.
Solution Approach 2:
The invention applies local quality by providing end portions only at specific locations where ground connections are needed, rather than using through-holes throughout the entire structure. This localized approach reduces the overall processing size required for connections while maintaining effective radiation noise reduction.
3Object-affected harmful factors
If traditional shield layer configuration with through-holes is used, then radiation noise is reduced, but achieving higher density wiring layout is limited
Solution Approach 1:
By extracting the connection function from through-holes and implementing it through end portions, the invention removes the bottleneck that limited wiring density. This allows signal lines to be placed more closely together without being constrained by through-hole positioning requirements, thereby achieving higher productivity in terms of wiring density.
Solution Approach 2:
The invention changes the structural parameter of the insulating layer by extending end portions beyond the insulating layer boundary. This parameter change fundamentally alters the connection mechanism, enabling higher wiring density while maintaining radiation noise reduction effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces radiation noise and enables smaller, more flexible wiring boards with improved signal quality and reduced manufacturing costs.
Implementation Method 1
a connection conductor line configured to electrically connect the shield layer to the at least one ground line is provided on part of the at least one end portion
Data Source
AI summary
A wiring board includes a wiring layer, a shield layer, and an insulating layer. The wiring layer includes at least one signal line and at least one ground line. The shield layer overlaps the wiring layer in plan view. The insulating layer is provided between the wiring layer and the shield layer. The insulating layer includes at least one end portion surrounded by the insulating layer. The at least one end portion is located on at least the at least one ground line. A connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.