Shielding Assembly Heat Pipe Structure for Cooling Electronic Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat dissipation structures in electronic devices, such as smartphones or tablet computers, fail to achieve an effective heat dissipation effect due to large thermal resistance and limited dissipation area, leading to performance degradation of electronic components.
Innovation Solution
A shielding assembly is introduced comprising a shielding case, a capillary structure, and a thermally conductive plate, with a sealing cavity filled with a working substance that circulates between vaporization and condensation zones for efficient heat exchange, enhancing the heat dissipation area and rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shielding case and housing are used for heat dissipation, then the electronic components are shielded from external signals, but the heat dissipation effect is insufficient due to large thermal resistance and limited dissipation area
Solution Approach 1:
The patent introduces a phase change material that undergoes phase transition (solid-liquid or liquid-gas) to absorb and dissipate heat from electronic components. The phase change material is positioned between the electronic components and the shielding case, utilizing the latent heat of phase transition to enhance heat dissipation efficiency while maintaining the shielding function of the case
Solution Approach 2:
The patent embeds the phase change material within the shielding case structure, creating a nested configuration where the heat dissipation function is integrated into the shielding structure. The electronic components are positioned within the shielding case, with the phase change material surrounding or adjacent to them, forming a multi-functional integrated structure that provides both shielding and enhanced heat dissipation
2Device complexity
If the shielding case and housing are used for heat dissipation, then the structure is simple, but the heat dissipation area is limited
Solution Approach 1:
The patent utilizes the internal three-dimensional space within the shielding case to position the phase change material, transforming the heat dissipation from a surface-based process to a volumetric process. The phase change material fills the available space around the electronic components, significantly increasing the effective heat dissipation area without increasing the external dimensions of the device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation efficiency, enabling rapid cooling of electronic components and ensuring optimal operating temperatures by increasing the heat dissipation area and rate, thus maintaining component performance.
Implementation Method 1
The sealing cavity includes a vaporization zone and a condensation zone. The vaporization zone is located above the electronic components. The capillary structure is configured to enable the working substance to back flow from the condensation zone to the vaporization zone.
Implementation Method 2
The capillary structure is disposed in the sealing cavity. The capillary structure is configured to enable the working substance to back flow from the condensation zone to the vaporization zone.
Implementation Method 3
the working substance may circulate between the vaporization zone and the condensation zone for heat exchange, so that heat at the electronic components may be conducted to a region of the shielding assembly that is away from the electronic components
Data Source
AI summary
An embodiment of this application provides an electronic device. The electronic device includes at least a mainboard, electronic components, and a shielding assembly. The shielding assembly includes a shielding case, a capillary structure, and a thermally conductive plate. The electronic components are located in the shielding case and connected to the shielding case. The thermally conductive plate is located on a side of the shielding case that faces away from the electronic components. The thermally conductive plate is connected to the shielding case to form a sealing cavity. The capillary structure is disposed in the sealing cavity. The sealing cavity is filled with a working substance. The sealing cavity includes a vaporization zone and a condensation zone. The vaporization zone is located above the electronic components. The capillary structure is configured to enable the working substance to back flow from the condensation zone to the vaporization zone.