Shielding Body Movement Recipe for Plating Uniformity
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Solution Overview
Problem
Existing plating apparatuses face challenges in achieving uniformity of the plating film on substrates, as the growth speed of the plating film can vary significantly across different areas, leading to inconsistencies in the final coating.
Innovation Solution
A method is proposed where a shielding body in a plating apparatus is programmed with a forward/backward movement recipe based on calculated plating growth coefficients for each certain-angle area of the substrate. This recipe dictates the positioning of the shielding body between the substrate and the anode, allowing for precise control over plating conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a shielding body moves between the substrate and anode to adjust plating conditions, then the growth speed of plating film can be controlled, but the uniformity of plating film across different areas deteriorates due to varying growth speeds
Solution Approach 1:
The patent divides the substrate into multiple certain-angle areas and calculates separate plating growth coefficients for each area based on the resist pattern. The shielding body is controlled to move to different positions corresponding to different angular areas, allowing each region to receive customized shielding and achieve uniform plating thickness across the entire substrate despite local variations in growth speed.
Solution Approach 2:
The shielding body is designed to move dynamically between the substrate and anode during the plating process. By adjusting the position of the shielding body in real-time based on pre-calculated movement recipes for each angular area, the system adapts to local plating conditions and maintains uniform film formation throughout the plating process.
2Adaptability or versatility
If shielding body position is adjusted during plating treatment based on detected values, then plating conditions can be optimized, but control efficiency and film uniformity deteriorate compared to predetermined movement
Solution Approach 1:
The patent calculates plating growth coefficients for each certain-angle area in advance based on the resist pattern before plating begins. Movement recipes for the shielding body are predetermined based on these pre-calculated coefficients, allowing the system to achieve optimal and uniform plating results without requiring real-time detection and adjustment during the plating process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
By implementing this method, the plating apparatus can significantly improve the uniformity of the plating film across the substrate, ensuring consistent film thickness and quality.
Implementation Method 1
a conductive film (plating film) is precipitated on the surface of a substrate, by immersing a substrate (for example, a semiconductor wafer), which is held by a substrate holder with a plating target surface facing downward, into plating solution, and applying voltage between the substrate and an anode
Data Source
AI summary
There is provided method and a plating apparatus capable of improving uniformity of a plating film formed on a substrate. There is proposed a method for, in a computer, setting a forward/backward movement recipe for a shielding body in a plating apparatus, the plating apparatus including the shielding body, the shielding body being movable to a shielding position interposed between a plating target surface of a substrate and an anode and to a retracted position retracted from between the plating target surface of the substrate and the anode; and the method includes steps of: acquiring a resist pattern of the substrate, calculating a plating growth coefficient for each certain-angle area of the substrate based on the acquired resist pattern, and setting the forward/backward movement recipe for the shielding body based on the calculated plating growth coefficient for each certain-angle area.