Shielding Assembly With Capillary Cooling for Electronic Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation structures in electronic devices are inefficient, leading to performance degradation due to accumulated heat from electronic components.
Innovation Solution
An electronic device design incorporating a shielding assembly with a shielding case, a capillary structure, and a thermally conductive plate, where the capillary structure enables a working substance to circulate between a vaporization zone and a condensation zone for enhanced heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shielding case is used for heat dissipation, then electromagnetic shielding is provided, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent introduces a phase change material into the shielding case that undergoes phase transition (solid-liquid or liquid-gas) to absorb and dissipate heat from electronic components. This resolves the contradiction by maintaining electromagnetic shielding while significantly improving heat dissipation efficiency through the latent heat absorption during phase change.
Solution Approach 2:
The patent combines the shielding case with phase change materials to create a composite structure that simultaneously provides electromagnetic shielding and enhanced heat dissipation. This composite approach resolves the contradiction by integrating both functions into a single system rather than treating them separately.
2Productivity
If heat dissipation area is increased, then heat dissipation rate improves, but device structure becomes more complex
Solution Approach 1:
The patent merges the heat dissipation function with the existing shielding case structure by integrating phase change materials directly into the case. This combination increases the effective heat dissipation area without requiring separate heat dissipation components, thus improving heat dissipation rate while minimizing structural complexity.
Solution Approach 2:
The shielding case is designed to serve multiple functions: electromagnetic shielding, heat dissipation through phase change, and structural support. This multi-functionality resolves the contradiction by making the existing structure do more work without adding complex separate systems for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat dissipation efficiency by increasing the heat dissipation area and rate, facilitating rapid cooling of electronic components and enhancing the overall heat dissipation effect.
Implementation Method 1
The sealing cavity includes a vaporization zone and a condensation zone. The vaporization zone is located above the electronic components.
Implementation Method 2
The sealing cavity includes a vaporization zone and a condensation zone
Implementation Method 3
The capillary structure is configured to enable the working substance to back flow from the condensation zone to the vaporization zone
Implementation Method 4
The thermally conductive plate is located on a side of the shielding case that faces away from the electronic components. The thermally conductive plate is connected to the shielding case to form a sealing cavity.
Data Source
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AI summary
An embodiment of this application provides an electronic device. The electronic device includes at least a mainboard, electronic components, and a shielding assembly. The electronic components are disposed on the mainboard. The shielding assembly includes a shielding case, a capillary structure, and a thermally conductive plate. The electronic components are located in the shielding case and connected to the shielding case. The mainboard is connected to the shielding case to form a shielding space for shielding the electronic components. The thermally conductive plate is located on a side of the shielding case that faces away from the electronic components. The thermally conductive plate is connected to the shielding case to form a sealing cavity. The capillary structure is disposed in the sealing cavity. The sealing cavity is filled with a working substance. The sealing cavity includes a vaporization zone and a condensation zone. The vaporization zone is located above the electronic components. The capillary structure is configured to enable the working substance to back flow from the condensation zone to the vaporization zone. The electronic device in this embodiment of this application can improve a heat dissipation effect and implement fast heat dissipation of the electronic components.