Double-Layer Shielding Case With Heat Storage Material
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Solution Overview
Problem
As electronic components in terminal devices, such as mobile phones, generate increasing heat due to higher performance demands, existing technologies face challenges in effectively managing heat dissipation, leading to potential user experience issues from direct heat radiation.
Innovation Solution
A double-layer shielding case structure with interconnected first and second shielding case bodies, accommodating heat storage material between them, which absorbs and gradually dissipates heat from high-speed heating components, while preventing direct heat radiation outside the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single-layer shielding case is used, then the structure is simple, but the heat dissipation effect is insufficient
Solution Approach 1:
The shielding case is divided into a first shielding case body and a second shielding case body that are interconnected. The first shielding case body has a first top wall and a first side wall, while the second shielding case body has a second top wall and a second side wall. This segmentation creates a multi-chamber structure that increases the heat dissipation surface area and improves thermal management effectiveness.
Solution Approach 2:
The first shielding case body is nested within the second shielding case body, with the second shielding case body at least partially covering the first shielding case body. This nested configuration allows the heat storage material to be accommodated between the two bodies, creating an efficient thermal management system while maintaining a compact overall structure.
2Temperature
If heat storage material is added between shielding case bodies, then heat control is improved, but manufacturing complexity increases
Solution Approach 1:
The shielding case is segmented into two separate bodies that can be manufactured independently, allowing the heat storage material to be placed between them during assembly. This segmentation simplifies the manufacturing of each individual component while enabling effective heat control through the intermediate material layer.
Solution Approach 2:
The heat storage material acts as an intermediary between the first and second shielding case bodies. This intermediate layer absorbs and stores heat generated by heating components, preventing direct heat transfer to the exterior of the terminal device and improving overall heat control.
3Temperature
If the second shielding case body covers the first shielding case body, then heat absorption surface area is increased, but device volume increases
Solution Approach 1:
The first shielding case body is nested within the second shielding case body, creating a compact concentric structure. This nesting arrangement maximizes the heat absorption surface area by providing multiple walls (first top wall, first side wall, second top wall, second side wall) that can absorb heat, while maintaining a relatively small overall volume.
Solution Approach 2:
The shielding case utilizes three-dimensional spatial arrangement with the second shielding case body covering the first shielding case body in a nested configuration. This dimensional arrangement creates multiple heat absorption surfaces in different spatial orientations, increasing the effective heat absorption capacity without proportionally increasing the device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from high-speed heating components within terminal devices, enhancing heat control by providing a large superficial surface for absorption and preventing direct heat radiation, thereby improving user experience.
Implementation Method 1
a heat storage material is accommodated between the first shielding case body and the second shielding case body
Implementation Method 2
the heat storage material accommodated between the two shielding case bodies can absorb and store the heat radiated by a heating component
Implementation Method 3
the present disclosure not only realizes the dissipation of heat from a heating component that is running at a high speed, but also avoids the dissipated heat being directly radiated onto the outside of a terminal device
Data Source
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AI summary
Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) that are interconnected, wherein the second shielding case body (2) at least partially covers the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).