Electromagnetic Shielding Composition for Thin Film EMI Protection
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Solution Overview
Problem
Existing electromagnetic shielding layers for electronic components face challenges in achieving uniform thickness and enhanced EMI shielding effects, particularly as devices become smaller and thinner, with current methods like sputtering being time-consuming and costly, and existing compositions not adequately addressing the need for improved conductivity and reflection loss.
Innovation Solution
An electromagnetic shielding composition comprising silver particles with specific solvents having structures represented by formulas (1) and (2) and a boiling point less than 200°C, along with a dispersant, to form a shielding layer with low specific resistance and enhanced EMI shielding effect, achieved through spray coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal plate shielding layer is used, then EMI shielding effect is improved, but device size and thickness cannot be reduced
Solution Approach 1:
The patent applies this principle by using a thin film shielding layer formed through spray coating of electromagnetic shielding composition. The composition contains conductive particles (silver, copper, or aluminum) dispersed in a solvent, which when sprayed and dried forms a thin, flexible shielding film that maintains EMI protection while significantly reducing thickness compared to metal plate shielding layers.
2Manufacturing precision
If sputtering is used to form uniform shielding layer on top and side surfaces, then shielding layer uniformity is improved, but processing time and cost increase
Solution Approach 1:
The patent replaces the complex mechanical sputtering process with a simpler spray coating method. The electromagnetic shielding composition is sprayed onto the electronic component surfaces using a spray coating device, allowing simultaneous coating of multiple surfaces. This substitution of the deposition method reduces processing time and cost while achieving adequate shielding layer uniformity.
Solution Approach 2:
The patent uses a composite material approach by formulating an electromagnetic shielding composition consisting of conductive particles dispersed in a solvent with specific physical properties (boiling point 50-200°C, viscosity 10-1000 cP). This composite formulation enables the shielding layer to be applied through spray coating, achieving both uniformity and efficiency.
3Ease of manufacture
If existing EMI shielding composition is used, then shielding layer can be formed by spray coating, but specific resistance is high and EMI shielding effect is insufficient
Solution Approach 1:
The patent applies parameter changes by carefully controlling the physical properties of the solvent in the electromagnetic shielding composition. The solvent is selected with a boiling point of 50-200°C and viscosity of 10-1000 cP at 25°C. These parameter optimizations ensure proper spray coating performance while enabling formation of a shielding layer with sufficiently low specific resistance to achieve effective EMI shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition results in a shielding layer with increased conductivity and reflection loss, effectively enhancing the EMI shielding effect while maintaining uniform dispersion and preventing precipitation of silver particles, suitable for use in electronic components like power amplifiers and Wi-Fi/Bluetooth modules.
Implementation Method 1
a first solvent (B) that has at least one structure selected from the group consisting of a structure represented by the following formula (1) and a structure represented by the following formula (2) and has a boiling point of less than 200°C
Data Source
AI summary
An electromagnetic shielding composition includes silver particles (A), and a first solvent (B). The first solvent (B) has at least one structure selected from the group consisting of a structure represented by the formula (1) and a structure represented by the formula (2) and has a boiling point of less than 200° C.