Shielding Connector Structure for Slim Electronic Devices
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Solution Overview
Problem
Existing electronic devices face challenges in maintaining a slim design while increasing the number of connection terminals and providing effective shielding and easy maintenance due to limitations in interposer bonding and shielding capabilities.
Innovation Solution
An electronic device with a shielding connector structure featuring a receptacle and connector system that allows for efficient electrical connection and shielding of substrates, enabling easy detachment for maintenance and increased terminal count without enlarging the interposer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an interposer is bonded to substrates via soldering to increase connection terminals, then electrical connection between substrates is achieved, but maintenance becomes difficult and shielding of individual electrical elements is limited
Solution Approach 1:
The invention divides the connection structure into separate receptacles on the substrate and detachable connectors, replacing the monolithic bonded interposer. This segmentation allows individual components to be accessed, removed, or replaced for maintenance while maintaining electrical connections through multiple discrete contact points.
Solution Approach 2:
The invention transitions from a static bonded interposer to a dynamic detachable connector system. The connectors can be inserted and removed from receptacles, enabling maintenance operations without permanent attachment, while still providing reliable electrical connection when engaged.
2Quantity of substance
If an interposer is enlarged to increase the number of connection terminals, then more electrical connections are possible, but the electronic device size increases
Solution Approach 1:
The invention moves connection terminals from a two-dimensional planar arrangement on an enlarged interposer to a three-dimensional configuration using vertical receptacles and connectors. Multiple terminals can be stacked or arranged in layers, increasing terminal count without proportionally increasing the horizontal footprint.
Solution Approach 2:
The connector structure incorporates nested elements where connectors fit into receptacles, and multiple connection terminals are arranged in nested or stacked configurations. This allows high terminal density within a compact volume, avoiding the need to enlarge the overall interposer area.
3Reliability
If an interposer is used to electrically connect entire areas of substrates, then comprehensive electrical connection is achieved, but individual electrical element shielding becomes limited
Solution Approach 1:
The invention applies shielding selectively around individual electrical elements or groups of elements using receptacle structures, rather than requiring a continuous bonded interposer. Each receptacle can provide localized electromagnetic shielding for its contained connectors and terminals, allowing targeted interference protection where needed while maintaining overall electrical connectivity.
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing, a first substrate arranged in an inner space of the housing and including at least one electrical element, at least one receptacle including a plurality of conductive terminals arranged to at least partially surround the at least one electrical element included in the first substrate, and at least one connector detachably coupled to the at least one receptacle and including a plurality of connector terminals, wherein at least one of the plurality of conductive terminals may be electrically connected to the ground of the first substrate.