Shielding Cover Adhesive Dispensing for PCB-Mounted IC Retention
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Solution Overview
Problem
The existing control modules face issues with IC detachment from printed circuit boards due to solder fall-off during drop tests or other mechanical stress, leading to yield reduction and operational failures.
Innovation Solution
A control module design featuring a shielding cover with a dispensing hole for adhesive dispensing between the IC and the printed circuit board, ensuring secure bonding through both soldering and adhesive attachment, even if solder falls off.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If IC is soldered onto the printed circuit board, then the IC can be electrically connected and mechanically attached, but the IC may detach during mechanical stress due to solder fall-off
Solution Approach 1:
The patent combines two different bonding methods: soldering (metallic bonding) and adhesive bonding (polymer bonding). The IC is both soldered to the PCB and bonded with adhesive, creating a composite bonding system that leverages the strengths of both methods. The solder provides electrical connection and initial mechanical attachment, while the adhesive provides additional mechanical strength and redundancy, ensuring the IC remains attached even if solder falls off during mechanical stress.
2Reliability
If adhesive is dispensed between IC and printed circuit board, then the IC bonding reliability is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent segments the bonding function into two distinct parts: soldering (for electrical connection) and adhesive bonding (for mechanical reinforcement). This segmentation allows each method to perform its specialized function optimally. The adhesive is dispensed through a dispensing hole in the shielding cover, which segments the adhesive application to a specific location between the IC and PCB, ensuring precise and controlled bonding without requiring complex manufacturing equipment.
Solution Approach 2:
The shielding cover with a dispensing hole acts as an intermediary structure that enables adhesive dispensing. The dispensing hole provides a controlled pathway for adhesive to reach the bonding interface between IC and PCB without requiring direct access from above. This intermediary structure simplifies the manufacturing process by integrating the adhesive dispensing function into the existing shielding cover assembly.
3Object-affected harmful factors
If a shielding cover is soldered onto the printed circuit board to house the IC, then electromagnetic shielding is provided, but the IC remains vulnerable to detachment during mechanical stress
Solution Approach 1:
The patent makes the shielding cover multi-functional by adding adhesive dispensing capability to its electromagnetic shielding function. The shielding cover not only provides electromagnetic shielding for the IC but also serves as the structure through which adhesive is dispensed to bond the IC to the PCB. This multi-functionality resolves the contradiction by integrating mechanical bonding capability into the shielding structure without requiring separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively secures the IC on the printed circuit board, enhancing the yield and reliability of the control module by preventing detachment during mechanical stress, such as drop tests.
Implementation Method 1
dispensing an adhesive between the IC and the printed circuit board through the dispensing hole
Implementation Method 2
a shielding cover soldered onto the printed circuit board and housing the IC inside
Data Source
AI summary
Provided is a control module including a printed circuit board, an IC, and a shielding cover. The shielding cover is provided with a dispensing hole for adhesive dispensing. The IC is soldered onto the printed circuit board, and an adhesive may be dispensed between the IC and the printed circuit board through the dispensing hole. A method for manufacturing a control module is also provided.