Shielding Cover Rework Apparatus for PCB Solder Melting
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Solution Overview
Problem
The rework of shielding covers on miniaturized circuit boards is challenging due to manual operations, which are time-consuming and prone to damage, and the quality and stability of the process are not guaranteed.
Innovation Solution
A shielding cover mounting and dismounting apparatus with a base, supporting seats, heaters, and elastic members that allow for precise heating and movement to facilitate the removal and re-soldering of shielding covers without removing residual solder, using direct-contact and heat-conducting heating methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual operations are used to remove and re-solder shielding covers, then flexibility and adaptability are maintained, but the process becomes time-consuming and quality stability deteriorates
Solution Approach 1:
The apparatus is divided into distinct functional modules: a heating unit with temperature control, a pressing unit with adjustable pressure, and a positioning system. Each module operates independently but coordinates through centralized control, enabling automated rework while maintaining manageable complexity through modular design
Solution Approach 2:
The system performs automated heating, pressing, and positioning operations without manual intervention. The control unit automatically adjusts parameters and coordinates movements, allowing the apparatus to service itself during the rework process and eliminate time-consuming manual operations
2Reliability
If heat gun is used for manual heating, then equipment simplicity is maintained, but damage to integrated circuit chips occurs and quality stability worsens
Solution Approach 1:
The heating unit applies heat locally and uniformly to the shielding cover area through controlled thermal conduction. The pressing unit applies localized pressure only where needed to facilitate solder melting, minimizing thermal and mechanical impact on surrounding sensitive components while ensuring reliable heating at the target location
Solution Approach 2:
The system precisely controls heating temperature and pressing force parameters within optimal ranges. Temperature is maintained below damage thresholds for sensitive components while sufficient to melt solder, and pressing force is adjusted to achieve proper contact without excessive mechanical stress, ensuring high reliability without damage
3Loss of time
If shielding cover is removed completely, then rework flexibility is improved, but additional solder-removing processes are required and time consumption increases
Solution Approach 1:
The apparatus performs preliminary heating and pressing actions that soften the solder joints before complete removal is attempted. This preliminary treatment facilitates easier detachment and reduces the need for extensive subsequent solder cleaning operations, saving time while maintaining operational simplicity
Solution Approach 2:
The heating and pressing actions are applied continuously and uniformly during the removal process, ensuring consistent solder melting throughout the shielding cover perimeter. This continuous action enables complete removal in a single operation without requiring intermittent停顿 or additional cleaning steps, reducing total rework time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This apparatus accelerates the mounting and dismounting process while ensuring the quality and stability of the rework by allowing for efficient heating and re-soldering of shielding covers without damaging the circuit board or requiring removal of residual solder.
Implementation Method 1
using direct-contact and heat-conducting heating methods
Data Source
AI summary
A shielding cover mounting and dismounting apparatus for mounting or dismounting a shielding cover connected with a circuit board. The circuit board has an upper surface and a lower surface, and the shielding cover is connected with the lower surface. The apparatus includes a base, a first supporting seat, a second supporting seat, a heater and a moving seat. The first supporting seat is disposed on the base and has a bearing cavity. The shielding cover and the circuit board are disposed in the bearing cavity, and the shielding cover is disposed between the circuit board and a bottom surface of the bearing cavity. The second supporting seat is disposed in an opening of the bearing cavity. The heater is disposed at one side of the upper surface of the circuit board. The moving seat drives the heater to move closer to or away from the circuit board.