Shielding Enclosure with Detent Lid for Height Reduction
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Solution Overview
Problem
Existing electromagnetic interference (EMI) shielding enclosures for electronic devices face challenges in minimizing height while maintaining effective shielding performance, especially in compact devices where space is limited.
Innovation Solution
The design incorporates a frame with vertically extending sidewalls and horizontally inwardly extending lateral flanges with detent legs, and a lid with downwardly extending flanges featuring detent structures, allowing for a lower height by eliminating the need for upwardly extending flanges and utilizing detent slots or protrusions for secure engagement, thereby reducing the overall height and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional shielding enclosure designs with upwardly extending flanges are used, then structural stability and ease of assembly are improved, but the height of the shielding enclosure increases
Solution Approach 1:
The patent inverts the traditional flange configuration by eliminating upwardly extending flanges and instead using downwardly extending flanges with detent structures on the lid that engage with detent legs on the frame. This inversion allows the connection mechanism to function effectively without requiring upward extensions, thereby reducing the overall height of the shielding enclosure while maintaining connection stability through the detent engagement mechanism.
Solution Approach 2:
The patent transitions from a vertical connection approach (upwardly extending flanges) to a horizontal connection approach (laterally extending detent legs engaging with detent structures). This dimensional change allows the connection function to be achieved in the horizontal plane rather than requiring vertical extension, thus reducing the height dimension of the shielding enclosure while maintaining assembly stability.
2Ease of manufacture
If traditional shielding enclosure designs are used, then manufacturing simplicity is maintained, but manufacturing costs increase due to additional materials and processes
Solution Approach 1:
The patent extracts and eliminates the upwardly extending flanges from the traditional shielding enclosure design, retaining only the essential downwardly extending flanges and detent structures needed for connection. This extraction removes unnecessary material consumption and simplifies the manufacturing process by reducing the number of forming operations required, thereby lowering manufacturing costs while maintaining ease of manufacture.
Solution Approach 2:
The patent applies local quality by concentrating the connection functionality in specific localized detent structures and detent legs rather than requiring extensive upwardly extending flanges throughout the enclosure. This localized approach reduces overall material consumption while maintaining the necessary connection stability, and simplifies manufacturing by focusing structural complexity only where needed for engagement.
3Object-affected harmful factors
If conventional shielding enclosures are used, then shielding effectiveness is achieved, but the enclosure height increases compromising compact device integration
Solution Approach 1:
By inverting the flange configuration to use downwardly extending flanges with detent structures instead of upwardly extending flanges, the patent achieves the same EMI shielding effectiveness while significantly reducing the height of the shielding enclosure. The inverted configuration maintains the continuous conductive path necessary for EMI shielding without requiring vertical extension beyond the detent engagement point.
Solution Approach 2:
The patent achieves EMI shielding effectiveness by transitioning to a horizontal connection mechanism (detent legs engaging with detent structures) rather than relying on vertical flange extensions. This dimensional change allows the shielding function to be maintained through horizontal conductivity while minimizing vertical height, enabling better integration into compact electronic devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves effective EMI shielding with reduced height, lower installation stress, and cost, while ensuring a firm and vibration-resistant connection between the frame and lid, enhancing the shielding performance and reducing moisture ingress.
Implementation Method 1
The lid also includes flanges downwardly extending from edges of the top portion. At least one of the flanges has a detent structure, such that when the lid is installed on the frame the detent legs of the frame are engaged by the detent structure.
Implementation Method 2
electrically conducting (and sometimes magnetically conducting) material is interposed between the two portions of the electronic circuitry for absorbing and/or reflecting EMI energy
Data Source
AI summary
Disclosed herein are various exemplary embodiments of shielding enclosures. In an exemplary embodiment, a shielding enclosure generally includes a frame and a lid. The frame includes vertically extending sidewalls and horizontally inwardly extending lateral flanges therefrom. The lateral flanges define a top opening of the frame and include outwardly extending detent legs. The lid includes a top portion for covering the top opening of the frame. The lid also includes flanges downwardly extending from edges of the top portion. At least one of the flanges has a detent structure, such that when the lid is installed on the frame the detent legs of the frame are engaged by the detent structure. The detent structure may, for example, be detent slots or detent protrusions.