Flexible Shielding Film for PCB Electromagnetic Interference
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic devices face issues with electromagnetic interference and noise interference due to increased clock frequencies and data transfer rates, leading to malfunction and degradation in wireless connectivity, and existing shielding solutions like metal shields can be heavy and lose contact with printed circuit boards, compromising shielding performance.
Innovation Solution
A lightweight shielding film is developed that can be closely attached to printed circuit boards, featuring a conductive layer and a three-dimensional shaping layer to deform and conform to the board's shape, ensuring effective electromagnetic wave blocking without the need for a sidewall structure or increased weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional metal shield cans are used for electromagnetic shielding, then shielding performance is improved, but weight increases and contact stability with the printed circuit board deteriorates
Solution Approach 1:
The patent replaces rigid metal shield cans with a flexible shielding film comprising a resin adhesive layer, a shielding layer, and an insulating layer. This thin film structure achieves effective electromagnetic shielding while dramatically reducing weight and eliminating contact stability issues associated with rigid shield cans.
Solution Approach 2:
The shielding film employs a composite multi-layer structure combining resin adhesive material, conductive shielding material (such as metal foil or conductive polymer), and insulating material. This composite approach integrates the benefits of each material to achieve lightweight construction with effective electromagnetic interference protection.
2Object-affected harmful factors
If traditional metal shield cans are used for electromagnetic shielding, then shielding performance is improved, but contact stability with the printed circuit board deteriorates
Solution Approach 1:
The flexible shielding film can conform to the printed circuit board surface and maintain reliable contact through its adaptability, unlike rigid shield cans that may lose contact due to thermal expansion, vibration, or board deformation.
Solution Approach 2:
The resin adhesive layer undergoes phase transition from uncured to cured state, changing from a flexible, conformable state to a stable, bonded state. This parameter change enables the film to adapt to the board surface during application and then maintain stable contact during operation.
3Object-affected harmful factors
If shielding structures with sidewall are used to protect electronic parts, then electromagnetic shielding is improved, but device complexity and weight increase
Solution Approach 1:
The flat shielding film eliminates the need for complex sidewall structures by providing a conformable surface-mounted solution that achieves shielding effectiveness through its conductive layer and proper grounding, simplifying the overall device structure.
Solution Approach 2:
The invention extracts only the essential shielding function from the complex shield can structure, using a simplified flat film configuration that provides electromagnetic protection without requiring three-dimensional enclosures or sidewalls.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding film provides a wide shielding area while maintaining close contact with the printed circuit board, effectively blocking electromagnetic waves and improving connectivity by being lighter and more adaptable than traditional shield cans.
Implementation Method 1
a shielding film that is disposed on a printed circuit board... effectively blocking electromagnetic waves
Implementation Method 2
a three-dimensional shaping layer... to deform and conform to the board's shape
Implementation Method 3
The resin adhesive layer may include a thermoplastic resin adhesive... stably maintains connection with the ground after curing
Data Source
Figure 1
Figure 2~3
Figure 4a~4b
AI summary
An electronic device and a shielding film are disclosed herein. The electronic device includes a printed circuit board and at least one electrical component mounted on the printed circuit board. The shielding film is disposed on at least a part of the printed circuit board to block electromagnetic waves generated by the printed circuit board and/or the electronic component. The shielding film includes a plurality of layers, and is attached to at least part of the printed circuit board and contacting an upper side surface of the electronic component, wherein at least part of the shielding film includes a nano-conductive fiber and is electrically connected with a ground part of the printed circuit board through the nano-conductive fiber.