3D Formed Electromagnetic Shielding Film for SIP Modules
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Solution Overview
Problem
Current electromagnetic shielding methods for system-in-package (SIP) modules are costly, complex, and environmentally polluting, with limited effectiveness in miniaturized devices and high-frequency operations.
Innovation Solution
A 3D formed electromagnetic shielding film comprising a molding layer, a conductive non-woven shielding layer embedded in an adhesive film, which is suitable for lead-free reflow soldering and provides effective electromagnetic shielding and physical protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetron sputtering is used for electromagnetic shielding, then effective coverage and interconnection are achieved, but the process becomes high in cost and complicated
Solution Approach 1:
The patent replaces expensive magnetron sputtering with a disposable conductive adhesive tape that can be directly applied and formed into 3D shapes. The tape is a low-cost, single-use material that eliminates the need for complex vacuum deposition equipment and processes, while still achieving effective electromagnetic shielding coverage.
Solution Approach 2:
The patent substitutes the mechanical/physical magnetron sputtering process with a chemical adhesive-based system. The conductive adhesive tape uses adhesive chemistry to bond to surfaces and maintain electrical continuity, replacing the physical sputtering mechanism with a simpler chemical bonding approach that is easier to implement.
2Area of stationary object
If spraying process is used for electromagnetic shielding, then coverage is achieved, but efficiency is low and defect rate is high
Solution Approach 1:
The patent applies preliminary action by pre-forming the conductive adhesive into a tape with the desired pattern and conductivity before application. This eliminates the need for complex spraying operations during assembly, as the shielding pattern is already prepared in advance, significantly improving production efficiency and reducing defects.
Solution Approach 2:
The conductive adhesive tape is a disposable, pre-prepared component that can be quickly applied without requiring complex spraying equipment or skilled operators. This simple, low-cost material delivers consistent coverage with high efficiency, eliminating the low productivity and high defect rate associated with spraying processes.
3Reliability
If electroplating/electroless plating is used for electromagnetic shielding, then conductive layer is formed, but environmental pollution is serious and plating layer lacks protection
Solution Approach 1:
The patent replaces electroplating/electroless plating with a disposable conductive adhesive tape that contains conductive particles embedded in an adhesive matrix. This eliminates the need for harmful plating chemicals and wastewater treatment, while the tape provides both conductivity and mechanical protection in a single, environmentally benign component.
Solution Approach 2:
The conductive adhesive tape is a composite material combining conductive particles (for electromagnetic shielding) with an adhesive matrix (for bonding and protection). This composite structure provides both the electrical conductivity needed for shielding and the mechanical protection that plating layers lack, without the environmental pollution associated with plating processes.
4Shape
If 3D formation is applied to electromagnetic shielding film, then shape conformability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent achieves 3D formation by changing the temperature parameter - heating the conductive adhesive tape to its transition temperature where it becomes pliable and can be formed into complex shapes. This simple thermal parameter change enables 3D conformability without requiring complex forming equipment or multi-step processes, maintaining manufacturing simplicity while achieving excellent shape conformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves excellent electromagnetic shielding performance, good plasticity, and reliability, while being compatible with lead-free reflow soldering processes, thus addressing the limitations of existing technologies.
Implementation Method 1
a conductive non-woven shielding layer embedded in the adhesive film
Implementation Method 2
By being subjected to thermoforming, the electromagnetic shielding film for a system-in-package circuit board according to the technical solution of the present invention is prone to have good electromagnetic shielding performance and good plasticity
Implementation Method 3
the molding layer and the adhesive film are laminated
Data Source
AI summary
The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagnetic shielding film to a circuit board. The circuit board includes an electronic component. The 3D formed electromagnetic shielding film includes a molding layer, a shielding layer, and an adhesive film. The molding layer and the adhesive film are laminated. The shielding layer is a conductive non-woven layer embedded in the adhesive film. A ratio of a surface area S2 of the electromagnetic shielding film after forming with an upper surface area of the electronic component deducted to a surface area S1 thereof before forming with the upper surface area of the electronic component deducted is 1.5 to 17. The electromagnetic shielding film is attached to the electronic component of a system-in-package module by means of a 3D formation process, and has good electromagnetic shielding performance. The circuit board to which the 3D formed electromagnetic shielding film is attached is suitable for a wave soldering process or a reflow soldering process in a subsequent manufacturing procedure, and the reflow soldering process does not cause any damage to the electromagnetic shielding film.