Shielding Frame With Sub-Wavelength Posts For Noise And Heat Management
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Solution Overview
Problem
In electronic device modules, the miniaturization of chip sizes and increased number of input/output terminals lead to noise interference and heat dissipation issues due to the proximity of electronic devices, requiring effective noise blocking and heat management techniques.
Innovation Solution
An electronic device module is designed with a shielding frame that includes a heat dissipating portion and posts, where the spacing between posts is less than the wavelength of electromagnetic waves, and a heat transfer layer is used to dissipate heat, while the shielding frame is electrically connected to the substrate's ground to block noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic devices are disposed adjacent to each other in a single package, then integration density and productivity are improved, but electromagnetic noise interference and heat dissipation become problematic
Solution Approach 1:
The package is segmented into multiple isolation regions by partition walls, with each region containing a specific electronic device. This segmentation physically separates adjacent devices, preventing electromagnetic noise interference while maintaining high integration density within the compact package structure.
Solution Approach 2:
Partition walls act as intermediary structures between adjacent electronic devices. These walls serve as electromagnetic shields and thermal barriers, mediating the interaction between neighboring devices by blocking noise propagation and heat transfer, thus enabling dense packaging without compromising device performance.
2Productivity
If electronic devices are disposed adjacent to each other in a single package, then integration density is improved, but heat dissipation becomes problematic
Solution Approach 1:
The package structure is divided into separate isolation regions by partition walls, creating distinct thermal zones for each electronic device. This segmentation prevents heat accumulation from adjacent devices while maintaining compact packaging, enabling effective heat dissipation despite high integration density.
Solution Approach 2:
Partition walls function as thermal barriers between adjacent electronic devices, mediating heat transfer by blocking thermal conduction and convection pathways. This intermediary structure enables each device to maintain its own thermal environment, facilitating effective heat dissipation in densely packed configurations.
3Volume of moving object
If chip sizes are reduced and number of input/output terminals is increased, then miniaturization and functional diversification are achieved, but pitch of electrode pads becomes smaller requiring advanced packaging
Solution Approach 1:
The patent transitions from planar packaging to three-dimensional stacked packaging with multiple layers and vertical interconnections. This dimensional change allows increased number of I/O terminals and reduced chip sizes without further reducing pad pitch, as connections are established through vertical vias and interlayer routing rather than only lateral trace routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively blocks electromagnetic noise and rapidly dissipates heat generated by the devices, enhancing the reliability and performance of the electronic device module by reducing interference and heat-related damage.
Implementation Method 1
a heat transfer layer disposed between the first device and the heat dissipating portion
Implementation Method 2
a shielding frame mounted on the substrate to accommodate the first device... A spacing distance between the posts is smaller than a wavelength of an electromagnetic wave introduced into the first device or output from the first device
Data Source
AI summary
An electronic device module includes a substrate, a first device and a second device mounted on the substrate, and a shielding frame mounted on the substrate to accommodate the first device. The shielding frame includes a heat dissipating portion stacked on the first device, and posts extended from an edge of the heat dissipating portion and spaced apart from each other. A spacing distance between the posts is smaller than a wavelength of an electromagnetic wave introduced into the first device or output from the first device.