Shielding Frame Notch Layout to Prevent Solder Interference
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Solution Overview
Problem
Miniature shielding structures in electronic devices are prone to interference during assembly due to overflowing solder material, complicating the assembly process and hindering miniaturization efforts.
Innovation Solution
A shielding structure design featuring a border frame with notches between pads on the circuit board, a cantilever structure with engagement portions, and a shielding cover that prevents solder interference by maintaining a distance from the pads, allowing for miniaturization and improved assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the shielding structure is miniaturized to match slim device design, then the overall height is reduced, but the shielding structure becomes prone to interference from overflowing solder material during assembly
Solution Approach 1:
The border frame is segmented into multiple sections including a first section, second section, third section, and fourth section. The solder stopper is divided into multiple notches (first notch, second notch, third notch, fourth notch) positioned at different locations along the border frame. This segmentation creates multiple barriers that collectively prevent solder from reaching the shielding cover while allowing the overall structure to remain miniaturized.
Solution Approach 2:
The solder stopper acts as an intermediary component between the pads and the shielding cover. It is positioned between the first and second pads, and between the third and fourth pads, serving as a mediator that blocks solder flow from reaching the shielding cover during assembly, thereby solving the solder interference problem in miniaturized designs.
2Ease of manufacture
If traditional castle notches are used for assembly, then the shielding cover can be fixed to the frame, but the notches require certain size and alignment precision making miniaturization difficult
Solution Approach 1:
The solder stopper is segmented into multiple notches distributed along the border frame rather than using a single large castle notch. This segmentation allows each notch to be smaller and less precise individually, while collectively providing sufficient assembly guidance and fixation for the shielding cover, thereby reducing the overall manufacturing precision requirement.
Solution Approach 2:
The notches are positioned at specific locations (between first and second pads, between third and fourth pads) where they provide localized assembly guidance. This local quality approach means that precision is only required at these specific critical points rather than across the entire notch structure, making miniaturization more feasible.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design prevents solder interference, facilitates miniaturization by over 20%, enhances assembly efficiency, and reduces manufacturing costs by optimizing solder contact and assembly stroke.
Implementation Method 1
The border frame is soldered to the pads
Data Source
AI summary
An electronic device includes a circuit board and a shielding structure disposed on the circuit board is provided. A soldering portion is disposed on a surface of the circuit board. The soldering portion includes two pads. The shielding structure includes a shielding frame and a shielding cover. The shielding frame is disposed on the circuit board. The shielding frame includes a border frame, and the border frame is soldered to the two pads. The border frame includes a solder stopper. The solder stopper includes two notches. The two notches are between the two pads. The shielding cover is disposed on the shielding frame. As such, the overall height of the shielding structure can be reduced and the interference between the shielding structure and the solder material on the soldering portion can be improved.