Heat Dissipating Electromagnetic Shielding Structure

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Solution Overview

Problem

Conventional electromagnetic shielding structures for electronic devices are complex, costly, and have assembly challenges due to their high number of elements and variable designs, which complicate manufacturing and increase material and labor costs.

Innovation Solution

A heat dissipating electromagnetic shielding structure featuring a shielding frame with spring members and a heatsink, where the heatsink covers the second opening and spring members abut against it, creating a shielding space that effectively conducts heat away from electronic elements while reducing the number of elements and simplifying assembly by guiding the heatsink into position.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional electromagnetic shielding structure with multiple elements (shielding frame, thermal pads, shielding cover, heatsink) is used, then electromagnetic shielding effectiveness is achieved, but device complexity and manufacturing cost increase

Engineering Contradiction:

Improveelectromagnetic shielding effectivenessVSAvoidnumber of elements

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the shielding cover and heatsink into a single integrated component. The heatsink structure includes an upper surface that directly forms part of the electromagnetic shielding enclosure, eliminating the need for a separate shielding cover. This merging reduces the number of elements from four to three while maintaining both thermal dissipation and electromagnetic shielding functions.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heatsink is designed to serve dual functions: thermal management and electromagnetic shielding. The upper surface of the heatsink acts as both a heat dissipation surface and an electromagnetic shield, replacing the dedicated shielding cover. This multi-functionality reduces component count and simplifies the overall structure while maintaining shielding effectiveness.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If a conventional electromagnetic shielding structure with multiple elements is used, then electromagnetic shielding effectiveness is achieved, but manufacturing cost increases

Engineering Contradiction:

Improveelectromagnetic shielding effectivenessVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

By merging the shielding cover and heatsink into one component, the patent reduces the number of parts that need to be manufactured, stored, and assembled. This consolidation reduces material costs, manufacturing complexity, and assembly labor, directly lowering overall manufacturing cost while maintaining shielding effectiveness.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If a conventional electromagnetic shielding structure with multiple elements is used, then electromagnetic shielding effectiveness is achieved, but assembly difficulty increases

Engineering Contradiction:

Improveelectromagnetic shielding effectivenessVSAvoidassembly difficulty

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The integration of the shielding cover and heatsink into a single component reduces the number of assembly steps. Instead of assembling four separate elements (shielding frame, thermal pads, shielding cover, heatsink), the structure now requires assembling three elements (shielding frame, thermal pads, integrated heatsink-shielding cover), simplifying the assembly process and reducing assembly difficulty.

Inventive Principle:

Principle #5Merging (Combining)

4Reliability

If a conventional electromagnetic shielding structure with multiple elements is used, then electromagnetic shielding effectiveness is achieved, but production time increases

Engineering Contradiction:

Improveelectromagnetic shielding effectivenessVSAvoidproduction time

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

By consolidating the shielding cover and heatsink into one integrated component, the patent reduces the number of assembly operations required during production. This eliminates the need to separately position and fasten a shielding cover, thereby reducing production time and improving manufacturing efficiency while maintaining electromagnetic shielding effectiveness.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances manufacturing efficiency, reduces material and labor costs, and improves electromagnetic shielding effectiveness by simplifying the assembly process and ensuring effective heat dissipation and electromagnetic interference blocking.

Implementation Method 1

a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the spring members are bent toward the substrate... the spring members partially abut against the heatsink

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS11638367B2Electronic device and heat dissipating electromagnetic shielding structure

Publication Date: 2023.04.25 WISTRON NEWEB CORP

AI summary

An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.