Electromagnetic Shielding Structure Using Injection Molded Grooves
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Solution Overview
Problem
The existing electromagnetic shielding structures face high manufacturing costs and cumbersome processes due to the use of expensive laser heads for forming grooves in metal barrier walls, which limits their effectiveness and efficiency.
Innovation Solution
A method involving an injection mold to form non-conductive plastic sealing bodies with spacing grooves, followed by a conductive shielding layer that fills these grooves to create shielding barrier walls, eliminating the need for laser trenching and allowing for simultaneous formation of grooves between multiple circuit units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser trenching is used to form grooves for metal barrier walls, then electromagnetic shielding can be achieved, but manufacturing cost increases and manufacturing process becomes cumbersome
Solution Approach 1:
The patent combines the groove formation and shielding structure creation into a single injection molding process. The mold cavity directly forms both the spacing grooves and the metal barrier wall structures in one step, eliminating the need for separate laser trenching operations and simplifying the manufacturing process while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The injection molding process performs preliminary action by pre-forming the spacing grooves and shielding structures during the initial molding stage. This allows the grooves to be ready before metal barrier walls are added, eliminating the need for subsequent laser processing and reducing manufacturing complexity.
2Ease of manufacture
If laser heads are used for forming grooves, then grooves can be created, but manufacturing cost increases due to expensive equipment and limited usage life
Solution Approach 1:
The patent replaces expensive, limited-life laser heads with a durable injection molding system. The mold cavity, which forms the grooves, is a robust mechanical component with long service life, eliminating the need for costly laser equipment and reducing overall manufacturing device complexity and cost.
3Reliability
If metal barrier walls are added between electrical components, then electromagnetic isolation is achieved, but manufacturing process becomes cumbersome
Solution Approach 1:
The patent merges the formation of spacing grooves and metal barrier walls into a single injection molding operation. This combined process creates both features simultaneously, eliminating multiple separate manufacturing steps and significantly improving production efficiency while ensuring proper electromagnetic isolation between components.
Solution Approach 2:
The injection molding process performs preliminary action by pre-forming the spacing grooves and positioning structures before metal barrier walls are added. This preliminary preparation enables faster, more efficient assembly and reduces overall manufacturing time while maintaining electromagnetic isolation effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and simplifies the process by forming grooves and shielding structures in a single injection molding step, achieving effective electromagnetic shielding without the limitations of laser trenching.
Implementation Method 1
injecting a non-conductive plastic sealant into the injection molding cavities so as to form non-conductive plastic sealing bodies on the circuit units
Implementation Method 2
forming a conductive shielding layer on the non-conductive plastic sealing bodies, so that the conductive shielding layer covers the non-conductive plastic sealing bodies and fills the spacing grooves to form shielding barrier walls
Data Source
AI summary
Disclosed are an electromagnetic shielding structure and a manufacturing method thereof, and an electronic product. The manufacturing method includes covering an injection mold on a circuit substrate, so that different circuit units on the circuit substrate are respectively accommodated in different injection molding cavities of the injection mold; injecting a non-conductive plastic sealant into the injection molding cavities so as to form non-conductive plastic sealing bodies on the circuit units, wherein spacing grooves are formed between the non-conductive plastic sealing bodies; and forming a conductive shielding layer on the non-conductive plastic sealing bodies, so that the conductive shielding layer covers the non-conductive plastic sealing bodies and fills the spacing grooves to form shielding barrier walls, thereby realizing shielding between the different circuit units in respective cavities.