Electromagnetic Shielding Material Intaglio Transfer Method
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Solution Overview
Problem
Existing electromagnetic shield materials face issues with forming fine patterns, slow productivity, and cost reduction due to difficulties in transferring conductive mesh patterns accurately, leading to incomplete adhesion and decreased shielding characteristics.
Innovation Solution
A method involving pressure-bonding a plate with intaglio parts filled with unhardened conductive composition onto a base material through a primer layer that hardens during the process, ensuring accurate transfer and increased thickness of the functional ink or conductive layer without cavities, enhancing adhesiveness and transferability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If silkscreen printing is used to form a mesh pattern, then the electromagnetic shield material can be manufactured, but fine patterns cannot be formed and productivity is slow
Solution Approach 1:
The patent changes the printing method from silkscreen printing to intaglio printing, which uses different physical parameters (plate depth, pressure, ink viscosity) to achieve both fine pattern formation and high productivity. The intaglio process allows precise control of pattern dimensions while maintaining fast production speed.
Solution Approach 2:
The patent replaces the silkscreen printing mechanical system with an intaglio printing system that uses a different mechanism (pressure-driven ink transfer from recessed areas) to achieve superior pattern precision without sacrificing production speed.
2Manufacturing precision
If offset printing is used to transfer the mesh pattern, then fine patterns can be formed, but the pattern may not be accurately transferred due to multiple transfer steps
Solution Approach 1:
The patent extracts the intermediate transfer step from the printing process by using intaglio printing that transfers the pattern directly from the plate to the base material in a single step, eliminating the source of accuracy degradation while maintaining fine pattern capability.
Solution Approach 2:
Instead of transferring the pattern through an intermediate medium (offset method), the patent inverts the approach by directly impressing the pattern from the intaglio plate onto the base material, ensuring the original pattern accuracy is preserved.
3Manufacturing precision
If the conductive composition is transferred by conventional intaglio printing, then the pattern can be formed, but wire breakage and low adhesiveness occur due to cavities in the layer
Solution Approach 1:
The patent applies local quality control by adjusting the composition and viscosity of the conductive ink specifically for intaglio printing, and by controlling the filling of intaglio parts to ensure complete coverage without cavities, thereby achieving both pattern precision and strong adhesion.
Solution Approach 2:
The patent performs preliminary action by optimizing the conductive composition formulation and the intaglio plate design before printing, ensuring that the material flows properly into the intaglio parts and cures without cavities, preventing adhesion problems before they occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of electromagnetic shield materials with improved adhesiveness and transfer efficiency, reducing issues like wire breakage and low adhesiveness, while increasing the thickness and conductivity of the shield layer, thus enhancing electromagnetic shielding performance.
Implementation Method 1
a primer layer which has fluidity until being hardened by ionizing radiation or heat treatment
Data Source
AI summary
Intended is to provide an electromagnetic shielding material having a conductive layer pattern by transferring a conductive composite to a transparent base material, and an electromagnetic shielding material having a metal layer formed on the transferred conductive layer. The electromagnetic shielding material is free from the troubles such as the breaking of wire, the non-conforming shape or the low contact, which is based on the non-conforming transfer of the conductive composite. The electromagnetic shielding material comprises a transparent base material, a primer layer formed over the transparent base material, and a conductive layer formed in a predetermined pattern on the primer layer. In the primer layer, a portion having the conductive layer formed therein has a thickness larger than the thickness of a portion without the conductive layer.