Electronic Component Module with Shielding Layer and Connection Member
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Solution Overview
Problem
The challenge in the electronic component module market is to achieve miniaturization and effective electromagnetic interference (EMI) shielding while ensuring heat dissipation, particularly for high-frequency components like communications and network modules, where existing solutions fail to adequately integrate shielding and heat management.
Innovation Solution
The proposed electronic component module incorporates a substrate with an electronic element, encapsulant, shielding members made of polymer materials with conductive metals, and a connection member, featuring a shielding layer that covers the shielding members and connection members to enhance electromagnetic wave shielding and heat dissipation. The shielding members are strategically spaced to prevent breakage and improve thermal expansion compatibility, with the connection members connecting the electronic element to the shielding members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shielding members are disposed close to each other to improve EMI shielding effectiveness, then electromagnetic wave shielding performance is improved, but the shielding members may break due to stress concentration
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the first and second shielding members. This resin layer acts as a stress-absorbing buffer that prevents direct stress transmission between adjacent shielding members, thereby preventing breakage while allowing the members to be positioned close together for effective EMI shielding.
Solution Approach 2:
The shielding members are constructed using composite materials consisting of conductive particles dispersed in a polymer matrix. This composite structure provides both the electrical conductivity needed for EMI shielding and the mechanical flexibility to withstand stress without breaking, resolving the contradiction between shielding effectiveness and structural strength.
2Volume of moving object
If the module size is reduced to achieve miniaturization, then portability is improved, but heat dissipation becomes more difficult
Solution Approach 1:
Thin film heat dissipation structures are integrated into the module design, allowing efficient thermal management in a compact form factor. These thin film structures provide large surface area for heat dissipation relative to the small module volume, enabling effective cooling without increasing overall size.
Solution Approach 2:
The encapsulant uses composite materials with both structural and thermal management functions. The composite structure provides mechanical protection while simultaneously facilitating heat dissipation through thermally conductive pathways, addressing both miniaturization and thermal management requirements.
3Object-affected harmful factors
If shielding members are made thicker to improve EMI shielding, then electromagnetic wave shielding performance is improved, but the module size increases
Solution Approach 1:
The shielding members utilize composite materials with high electrical conductivity to achieve effective EMI shielding with reduced thickness. The conductive particles in the polymer matrix provide superior shielding performance per unit thickness compared to traditional solid metal shields, enabling thin-profile shielding that meets EMI requirements without increasing module size.
Solution Approach 2:
The shielding performance is optimized by adjusting parameters such as conductive particle concentration, particle size distribution, and polymer matrix composition rather than simply increasing shielding member thickness. This parameter optimization allows achieving required shielding effectiveness with minimal thickness, maintaining compact module dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves both electromagnetic wave shielding and heat dissipation performance, reducing the risk of shielding member breakage and enhancing thermal management, thus addressing the miniaturization and EMI challenges in high-frequency electronic components.
Implementation Method 1
a shielding layer covering the first shielding member and the second shielding member
Implementation Method 2
a connection member connecting the electronic element to the second shielding member
Data Source
AI summary
An electronic component module includes a substrate; an electronic element disposed on a first surface of the substrate; an encapsulant encapsulating the electronic element; a first shielding member disposed on a first surface of the encapsulant to surround the electronic element; a second shielding member disposed on a second surface of the encapsulant and spaced apart from the first shielding member; a shielding layer covering the first shielding member and the second shielding member; and a connection member connecting the electronic element to the second shielding member.