Shielding Layer Package for Compact Electronic Devices

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Solution Overview

Problem

Existing electromagnetic shielding structures for semiconductor packages suffer from increased height due to air gaps, which hinder heat dissipation and degrade shielding performance, particularly in portable electronic devices where miniaturization and weight reduction are critical.

Innovation Solution

A circuit element package design featuring a first shielding layer with high viscosity, a second shielding layer electrically connected to the first, and an edge bridge, along with an insulating layer and gas discharge holes, to minimize thickness while maintaining effective electromagnetic shielding and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an air gap is provided between the elements and the inner surface of the metal shield can to prevent short circuit, then electrical insulation is improved, but the overall height of the electromagnetic shielding structure is increased

Engineering Contradiction:

Improveelectrical insulationVSAvoidoverall height

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

An insulating layer is introduced as an intermediary substance between the circuit elements and the first shielding layer. This insulating layer provides the necessary electrical insulation to prevent short circuits while having minimal thickness, thus avoiding the height increase that would result from a large air gap. The insulating layer acts as a mediator that maintains electrical isolation without sacrificing compactness.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If heat dissipation holes are formed on the shield can to improve heat dissipation, then thermal management is improved, but electromagnetic shielding performance deteriorates

Engineering Contradiction:

Improveheat dissipationVSAvoidelectromagnetic shielding performance

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The shielding structure is designed with non-uniform local properties: the first and second shielding layers are made of electromagnetic shielding material with high viscosity to maintain structural integrity and shielding performance in most areas, while gas discharge holes are strategically positioned in specific regions where shielding requirements are lower. This local differentiation allows heat dissipation in critical areas without compromising overall electromagnetic shielding performance.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The first shielding layer incorporates gas discharge holes that create a porous structure in specific regions. This porous design enables gas and heat to escape from the epoxy underfill while the surrounding solid shielding material maintains electromagnetic shielding effectiveness. The selective porosity allows thermal management without sacrificing shielding performance in critical zones.

Inventive Principle:

Principle #31Porous materials

3Weight of moving object

If the shielding structure is miniaturized to reduce weight and size for portable devices, then portability is improved, but heat dissipation capability is reduced

Engineering Contradiction:

Improveshielding structure weightVSAvoidheat dissipation capability

Core Design Contradiction:

Weight of moving objectVSTemperature

Solution Approach 1:

Gas discharge holes are incorporated into the first shielding layer to create a porous structure that enables heat and gas escape pathways within the miniaturized shielding structure. This porous design allows the compact shielding can to maintain effective heat dissipation capability despite its reduced size and weight, addressing the thermal management challenges of portable devices.

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves minimal thickness with enhanced electromagnetic shielding and improved heat dissipation, addressing the limitations of traditional shielding structures by integrating the shielding layers and insulating materials to prevent short circuits and optimize thermal management.

Implementation Method 1

a first shielding layer covering a side surface of the insulating layer

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

The first shielding layer may include an electromagnetic shielding material having a viscosity greater than a viscosity of the insulating layer

Methodology Applied

Scientific EffectViscosity: Viscometer

Implementation Method 3

an edge bridge electrically connecting the first shielding layer to the second shielding layer

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 4

gas discharge holes disposed in portions of the first shielding layer and discharging gas that is generated by the epoxy underfill

Methodology Applied

Scientific EffectGas discharge:

Data Source

PatentUS10566293B2Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof

Publication Date: 2020.02.18 SAMSUNG ELECTRONICS CO LTD

AI summary

A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.