Shielding Member for Uniform Metallic Coating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional film formation devices for metallic coatings experience non-uniform film thickness due to localized concentration of electric lines and current density variations at the peripheral edge of the film formation region, leading to excessive metal ion deposition.
Innovation Solution
Incorporating a shielding member to surround the outer peripheral surface of the anode, which shields electric lines and reduces current concentration at the peripheral edge, ensuring uniform metal ion deposition across the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional film formation device without a shielding member is used, then the device structure is simple, but current density varies in the film formation region causing non-uniform film thickness
Solution Approach 1:
A shielding member is introduced as an intermediary component between the anode and the substrate. This shielding member modifies the electric field distribution by blocking or redirecting electric field lines, thereby preventing current concentration at the peripheral edges and achieving uniform current density across the film formation region.
Solution Approach 2:
The shielding member is strategically positioned to create localized modifications in the electric field distribution. By placing the shielding member at specific locations (surrounding the anode's outer peripheral surface), the electric field is redistributed to achieve uniform current density specifically in the film formation region, addressing the local non-uniformity problem.
2Manufacturing precision
If no shielding member is used, then the device is easier to manufacture, but metal ions are excessively deposited at the peripheral edge causing non-uniform coating
Solution Approach 1:
The shielding member serves as an intermediary that controls the electric field distribution without requiring complex manufacturing processes. It can be made from simple insulating or conductive materials and positioned around the anode, providing an effective solution to peripheral edge deposition while maintaining ease of manufacture.
Solution Approach 2:
The shielding member can be implemented using simple, inexpensive materials such as insulating rings or conductive shields that are easy to manufacture and replace if needed. This approach provides a cost-effective solution to the uniformity problem without requiring complex or expensive device modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses current density variations, allowing for the formation of metallic coatings with consistent film thickness.
Implementation Method 1
metal ions internally contained in the solid electrolyte membrane are deposited by applying a voltage while pressurizing the surface of the substrate by the solid electrolyte membrane with a fluid pressure of a solution, thus forming the metallic coating on the surface of the substrate
Implementation Method 2
a shielding member disposed to surround an outer peripheral surface of the anode. The shielding member shields a line of electric force
Data Source
AI summary
Provided is a film formation device and a film formation method for a metallic coating that allow forming a metallic coating with a uniform film thickness. The film formation device of the present disclosure includes an anode, a solid electrolyte membrane, a power supply device, a solution container, and a pressure device. The solid electrolyte membrane is disposed between the anode and a substrate that serves as a cathode. The power supply device applies a voltage between the anode and the cathode. The solution container contains a solution between the anode and the solid electrolyte membrane. The solution contains metal ions. The pressure device pressurizes the solid electrolyte membrane to the cathode side with a fluid pressure of the solution. The film formation device further includes a shielding member disposed to surround an outer peripheral surface of the anode. The shielding member shields a line of electric force.


