Shielding Member for EMI Suppression in Compact Electronic Devices
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Solution Overview
Problem
As electronic devices become more integrated and compact, they face challenges with electromagnetic interference (EMI) that can reduce transmission rates and distort signals, affecting performance and power efficiency, and existing shielding structures are difficult to implement in slim designs.
Innovation Solution
An electronic device design incorporating a shielding member made of electrically conductive materials that surrounds the connection and circuit boards, electrically connected to the housing and circuit boards, forming an electromagnetic shielding structure to prevent interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding structure is added to suppress electromagnetic interference, then electromagnetic interference is reduced, but the device size increases and it becomes difficult to maintain a slim form factor
Solution Approach 1:
The shielding member is integrated with the circuit board as a unified structure, where the shielding member extends from the circuit board to form an L-shaped configuration. This merging eliminates the need for separate shielding components, achieving EMI suppression without increasing overall device volume.
Solution Approach 2:
The shielding member is disposed within the housing space, nesting the shielding function inside the existing device boundaries. The shielding member surrounds the connection member while fitting within the compact housing, allowing EMI protection without expanding the device envelope.
2Volume of moving object
If electronic components are highly integrated to reduce device size, then device compactness is improved, but electromagnetic interference increases affecting transmission rate and signal quality
Solution Approach 1:
The shielding member is strategically positioned to surround the connection member where EMI is most critical, rather than providing uniform shielding throughout the device. This localized shielding approach addresses the specific EMI problem area while minimizing impact on overall device compactness.
3Object-affected harmful factors
If a shielding member is added to surround connection members and circuit boards, then electromagnetic interference is suppressed, but device complexity increases
Solution Approach 1:
The shielding member is formed as an integral part of the circuit board structure, extending from the circuit board in an L-shape configuration. This merging reduces the number of discrete components and assembly steps, achieving EMI shielding without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses electromagnetic interference, maintaining stable operation and power efficiency while maintaining a slim and compact form factor by integrating the shielding member within the device's structure.
Implementation Method 1
a shielding member disposed to surround the connection member and the second circuit board inside the housing. The shielding member may be electrically connected to at least one of the housing and the first circuit board
Data Source
AI summary
According to various embodiments of the disclosure, an electronic device may comprise a housing at least partially including an electrically conductive material, a first circuit board disposed in the housing, a connection member disposed on the first circuit board and partially extending past an edge of the first circuit board, a second circuit board disposed in the housing and connected to the connection member from a side of the first circuit board in which the connection member extends, and a shielding member disposed to surround the connection member and the second circuit board inside the housing. The shielding member may be electrically connected to at least one of the housing and the first circuit board. Other various embodiments are possible.