Semiconductor Shielding Member Grounding Structure
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Solution Overview
Problem
Conventional high frequency semiconductor packages face issues with the fragility of fine ground pattern connections between the shielding member and substrate, making them prone to damage from impact or external forces.
Innovation Solution
A semiconductor package design featuring a ground electrode on the substrate with a shielding member that is in surface contact with both the electronic component and the ground electrode, where the shielding member is formed using a sputtering or vapor deposition method and is partially exposed externally to enhance structural integrity and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional shielding member is electrically connected to a ground pattern of a substrate using a very fine pattern connection portion, then electromagnetic shielding is achieved, but the connection portion becomes fragile and easily broken due to impact or external forces
Solution Approach 1:
The connection structure is divided into two parts: a wide pad pattern formed on the substrate and a fine pattern on the shielding member. This segmentation allows the fine pattern to be supported by the wide pad, reducing stress concentration and preventing breakage while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The wide pad pattern is pre-formed on the substrate before the shielding member is attached. This preliminary action creates a robust foundation that supports the subsequent fine connection pattern, ensuring mechanical strength before the actual connection is made.
2Object-affected harmful factors
If a fine pattern connection is used between the ground pattern and shielding member, then electromagnetic shielding characteristics are implemented, but the connection portion is prone to damage from impact
Solution Approach 1:
The connection structure is divided into two parts: a wide pad pattern formed on the substrate and a fine pattern on the shielding member. This segmentation allows the fine pattern to be supported by the wide pad, reducing stress concentration and preventing breakage while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The wide pad pattern acts as an intermediary between the substrate and the fine connection pattern on the shielding member. It serves as a mechanical buffer that absorbs impact forces, protecting the fine pattern from damage while maintaining electrical connectivity for electromagnetic shielding.
3Strength
If the shielding member is completely enclosed by sealing members, then protection is provided, but heat dissipation and electromagnetic shielding effectiveness are reduced
Solution Approach 1:
The sealing members are configured to provide localized protection: the internal sealing member protects the electronic component while the shielding member remains exposed. This local quality approach allows the shielding member to perform both electromagnetic shielding and heat dissipation functions without complete enclosure, while still providing necessary protection through the internal sealing member.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves the structural integrity of the shielding member by grounding it to the substrate, allowing for effective electromagnetic shielding and heat dissipation while preventing damage from external forces during manufacturing and usage.
Implementation Method 1
The shielding member may be disposed using a sputtering method or a vapor deposition method.
Implementation Method 2
The shielding member may be disposed using a sputtering method or a vapor deposition method.
Implementation Method 3
A portion of the ground electrode may be exposed externally of the internal sealing member and the ground electrode may be connected to the shielding member.
Data Source
AI summary
A semiconductor package includes a ground electrode formed on an upper surface of a substrate, a first electronic component disposed on the upper surface of the substrate, a sealing member sealing the electronic component, and a shielding member surrounding the first electronic component and disposed in the sealing member.