Shielding Module Layout for Wider Component Mounting Space

The conductive partition is divided into multiple separate partitions instead of using a single continuous structure. This segmentation allows the partitions to be arranged in a specific pattern that provides both EMI shielding and creates usable mounting spaces between them, thus resolving the contradiction between limiting EMI and providing mounting area.

The conductive partitions extend not only in the planar direction but also protrude in the vertical direction from the substrate surface. This three-dimensional arrangement creates regions between the protruding partitions where components can be mounted, effectively increasing the mounting region while maintaining EMI suppression functionality.

Multiple conductive partitions are merged into a single integrated conductive plate structure. The partitions are formed by cutting and folding a single continuous metal plate, which simplifies manufacturing compared to assembling multiple separate components, while still achieving the desired complex three-dimensional shielding configuration.

The conductive partition structure incorporates bent and folded portions that create dynamic spatial arrangements. These folds allow the partition to extend in multiple directions and create three-dimensional shielding regions without requiring complex assembly, as the shape is formed in a single manufacturing process.