Shielding Panel Opening for Heat Sink Protrusion

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Solution Overview

Problem

Electronic modules subject to FIPS compliance face challenges in preventing direct observation of internal components while maintaining adequate ventilation, leading to potential thermal performance issues due to obstructed airflow.

Innovation Solution

A shielding panel is arranged in a spaced relation to a substrate, allowing a heat sink to protrude through an opening, creating separate airflow paths that obstruct viewing while minimizing airflow obstruction, thus enabling higher thermal performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an opaque shielding panel is placed over ventilation openings to prevent direct observation of internal components, then security requirements are met, but airflow is blocked and thermal performance deteriorates

Engineering Contradiction:
Improvesecurity complianceVSAvoidthermal performance
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The shielding panel is segmented with openings that allow airflow paths to pass through. The panel divides the space into multiple regions while maintaining security by obstructing direct viewing angles, yet permits thermal management through strategically positioned gaps that enable convection currents to flow across the circuit board.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the shielding panel have different properties: solid opaque areas provide security and block viewing angles, while opening areas provide airflow paths for thermal management. This local differentiation allows the same panel to simultaneously satisfy both security requirements and thermal performance needs.

Inventive Principle:
Principle #3Local quality

2Reliability

If a shielding panel is placed close to the substrate to obstruct viewing angles, then security is improved, but airflow paths are blocked and ventilation is reduced

Engineering Contradiction:
Improvesecurity complianceVSAvoidventilation efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The shielding panel is positioned in spaced relation to the substrate, creating a three-dimensional airflow path between them. This spatial arrangement allows the panel to obstruct direct line-of-sight viewing angles for security while simultaneously enabling convection currents to flow in the vertical dimension between the panel and substrate, maintaining effective ventilation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Temperature

If ventilation openings are left open to maintain thermal performance, then airflow is improved, but direct observation of internal components becomes possible, compromising security

Engineering Contradiction:
Improvethermal performanceVSAvoidsecurity compliance
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The shielding panel acts as an intermediary element between the external environment and internal components. It obstructs direct viewing angles to prevent observation of sensitive information while incorporating openings that allow airflow to pass through, thus mediating between security requirements and thermal management needs.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents visual inspection of internal components while maintaining or improving thermal specifications, ensuring the electronic module's performance meets or exceeds non-compliant counterparts.

Implementation Method 1

a heat sink mounted on the substrate protrudes through an opening in the shielding panel

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a first airflow path is provided between the substrate and a first side of the shielding panel, and a second airflow path is provided on a second side of the shielding panel across a portion of the heat sink protruding through the opening

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS9317075B2Shielding panel having an opening for a heat sink
Publication Date: 2016.04.19 HEWLETT PACKARD ENTERPRISE DEV LP
  • US9317075B2 patent drawing
  • US9317075B2 patent drawing
  • US9317075B2 patent drawing

AI summary

An example provides an apparatus including a shielding panel in spaced relation to a substrate such that a heat sink mounted on the substrate protrudes through an opening in the shielding panel. A first airflow path may be provided between the substrate and a first side of the shielding panel, and a second airflow path may be provided on a second side of the shielding panel across a portion of the heat sink protruding through the opening.