Semiconductor Package Shielding Pillars for Compact EMI Isolation
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently reducing Electro-Magnetic Interference (EMI) while maintaining compact package dimensions and minimizing processing time, especially in the integration of EMI shielding structures within the packaging process.
Innovation Solution
A semiconductor package design featuring a premade shielding structure with conductive pillars inserted into through holes in a multilayer substrate, which includes a cover body and sidewalls, allowing for direct electrical connection to a circuit board without additional deposition processes, thereby reducing conductive resistance and processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional EMI shielding structures are integrated into semiconductor packaging, then EMI isolation is improved, but package size increases and processing time extends due to additional deposition steps
Solution Approach 1:
The patent combines the EMI shielding structure with the multilayer substrate by forming conductive shields directly within the substrate layers during the packaging process. This integration merges two previously separate components (shielding structure and substrate) into a unified structure, achieving EMI isolation without increasing overall package size or adding deposition steps.
Solution Approach 2:
The multilayer substrate serves multiple functions simultaneously: it provides mechanical support, electrical interconnection, and EMI shielding. The conductive shields formed within the substrate perform both electrical grounding and electromagnetic interference isolation, eliminating the need for separate shielding components and reducing package complexity.
2Object-affected harmful factors
If traditional EMI shielding structures with deposition processes are used, then EMI isolation is improved, but manufacturing time increases
Solution Approach 1:
The conductive shields are formed within the multilayer substrate during the substrate fabrication process itself, before the semiconductor die is packaged. This preliminary action integrates EMI shielding into the substrate manufacturing workflow, eliminating the need for separate deposition steps during the packaging process and reducing overall manufacturing time.
Solution Approach 2:
The patent merges the EMI shielding formation process with the substrate fabrication process. Conductive shields are created using the same lamination, drilling, and plating operations already performed to build the multilayer substrate structure, thereby achieving EMI isolation without extending the manufacturing timeline.
3Object-affected harmful factors
If additional deposition processes are used for EMI shielding, then shielding effectiveness is improved, but processing complexity increases
Solution Approach 1:
The patent combines the formation of conductive shields with the existing multilayer substrate fabrication processes. The same lamination, drilling, and plating operations used to create the substrate structure are also used to form the EMI shields, eliminating the need for additional deposition processes and maintaining ease of manufacture while achieving effective shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively isolates EMI, reduces the overall package size, and simplifies the manufacturing process by eliminating the need for extra deposition steps, enhancing both EMI shielding and manufacturing efficiency.
Implementation Method 1
The conductive pillars are fitted into through holes in a multilayer substrate... reducing conductive resistance
Data Source
AI summary
A semiconductor package includes a multilayer substrate, a device die, an insulating encapsulant, and a shielding structure. The multilayer substrate has a first surface and a second surface opposite to the first surface. The multilayer substrate includes through holes, and each of the through holes extends from the first surface to the second surface. The device die is disposed on the first surface of the multilayer substrate. The insulating encapsulant is disposed on the first surface of the multilayered substrate and encapsulating the device die. The shielding structure is disposed over the first surface of the multilayer substrate. The shielding structure includes a cover body and conductive pillars. The cover body covers the device die and the insulating encapsulant. The conductive pillars are connected to the cover body and fitted into the through holes of the multilayer substrate.