Shielding Plate Gas Flow for Substrate Edge Processing
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Solution Overview
Problem
Existing substrate processing techniques fail to adequately address the processing of the peripheral edge part of substrates while ensuring the upper surface is covered and protected, leading to inefficiencies in chemical processing and cleaning.
Innovation Solution
A substrate processing apparatus and method that includes a shielding plate to cover and protect the upper surface, a rotating mechanism, a processing mechanism to supply liquid to the edge, a scattering prevention mechanism to collect and discharge liquid, and a control unit to manage gas flow and temperature, ensuring effective processing of the edge while maintaining the upper surface integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding plate is used to protect the upper surface of the substrate, then the upper surface is protected from processing liquid, but the processing liquid scatters onto the peripheral edge part
Solution Approach 1:
A gas flow is introduced as an intermediary between the shielding plate and the substrate surface. The gas flows from the central part toward the radially outer side, creating a barrier that prevents processing liquid from scattering onto the peripheral edge while allowing the shielding plate to protect the upper surface
Solution Approach 2:
The invention uses gas flow (pneumatics) to control the behavior of processing liquid. By supplying gas through the shielding plate at controlled flow velocities, the system creates a pneumatic barrier that directs liquid flow and prevents unwanted scattering onto the substrate periphery
2Temperature
If the upper surface is heated while covered by a shielding plate, then the temperature is maintained, but the processing liquid cannot be effectively supplied to the peripheral edge
Solution Approach 1:
The shielding plate is segmented with gas supply openings that allow functional differentiation. The plate simultaneously maintains temperature (through heating elements) and allows processing liquid supply (through gas flow control from openings), resolving the contradiction between thermal maintenance and liquid access
3Object-generated harmful factors
If gas flow velocity is increased to prevent liquid scattering, then liquid management improves, but energy consumption increases
Solution Approach 1:
The gas flow velocity is optimized locally at the peripheral edge region where liquid scattering occurs. By concentrating gas flow at the radially outer side where it is most needed to prevent scattering, the system achieves effective liquid control with minimized overall energy consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for satisfactory processing of the peripheral edge part of substrates by covering and heating the upper surface, effectively managing liquid scattering and temperature, thereby enhancing the processing efficiency and quality.
Implementation Method 1
a gas supplier configured to supply the gas to a gas discharge nozzle provided in the shielding plate so as to form a flow of the gas from a central part toward a radially outer side of the substrate and discharge the gas into a space sandwiched between the substrate and the shielding plate
Implementation Method 2
a scattering preventing mechanism configured to collect the processing liquid scattered from the substrate according to rotation of the substrate holder
Data Source
AI summary
The invention includes a gas supplier for discharging a gas into a space sandwiched between a substrate and a shielding plate by supplying the gas to a gas discharge nozzle provided in the shielding plate to form a flow of the gas from a central part toward a radially outer side of the substrate. This gas supplier is controlled such that a flow velocity of the gas into a discharge space at a peripheral edge part of the substrate becomes larger than zero.