Shielding Plate Positioning for Semiconductor Substrate Particle Control
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Solution Overview
Problem
Existing substrate processing technologies face inefficiencies in removing chemical atmospheres during semiconductor substrate processing, leading to increased production time and potential particle formation due to incomplete removal of chemical solutions and gases.
Innovation Solution
A substrate processing apparatus with a shielding plate that moves in relation to the substrate, combined with a cup part and exhaust port, allows for controlled chemical solution application, efficient removal of chemical atmospheres, and effective dry processing by varying the shielding plate's position to manage gas flow and particle dispersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the interrupt member is in close proximity to the substrate, then the chemical solution can be effectively supplied to the substrate surface, but the chemical atmosphere cannot be efficiently removed and may adhere to the substrate causing particles
Solution Approach 1:
The interrupt member is made movable between a first position (close to substrate) for effective chemical solution supply and a second position (far from substrate) for efficient chemical atmosphere removal. This dynamic positioning resolves the contradiction by allowing the system to optimize for different operational phases.
Solution Approach 2:
The interrupt member periodically changes position between close proximity and separation from the substrate, alternating between chemical solution processing mode and chemical atmosphere removal mode. This periodic action enables both effective chemical solution supply and efficient chemical atmosphere exhaust.
2Productivity
If the interrupt member and substrate are widely separated, then the chemical atmosphere can be efficiently exhausted, but the amount of chemical atmosphere remaining in the space increases and may cause particles during dry processing
Solution Approach 1:
The interrupt member dynamically adjusts its position to be far from the substrate during chemical solution processing for efficient exhaust, then moves close to the substrate during dry processing to prevent remaining chemical atmosphere from causing particles.
Solution Approach 2:
The interrupt member moves to a position far from the substrate before chemical solution processing begins, preliminarily creating optimal conditions for chemical atmosphere exhaust. This prevents accumulation of harmful chemical atmosphere before it can cause particle formation.
3Manufacturing precision
If the interrupt member is in close proximity to the substrate during cleaning processing, then cleaning liquid can be effectively supplied, but the chemical atmosphere removal time increases and production efficiency decreases
Solution Approach 1:
The interrupt member moves to a position far from the substrate during cleaning processing, allowing efficient removal of chemical atmosphere while still enabling effective cleaning liquid supply. This dynamic positioning reduces cleaning processing time and improves production efficiency.
Solution Approach 2:
The system utilizes the vertical dimension (distance between interrupt member and substrate) to optimize both cleaning liquid supply and chemical atmosphere removal simultaneously, rather than being constrained to a fixed position that compromises either function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient removal of chemical atmospheres during cleaning and dry processing stages, reducing particle formation and improving production efficiency by maintaining a hypoxic environment and optimizing gas flow.
Implementation Method 1
an exhaust port provided in the cup part at a location below the substrate and for sucking and exhausting an ambient gas to outside of the cup part
Implementation Method 2
a substrate rotation mechanism for rotating the substrate along with the substrate holding part about a central axis pointing in an up-down direction
Data Source
AI summary
In a substrate processing apparatus, chemical-solution processing is performed by supplying a chemical solution to the upper surface of a substrate in a state where a top plate is located at a first relative position. Also, cleaning processing is performed by supplying a cleaning liquid to the upper surface of the substrate in a state where the top plate is located at a second relative position closer to the substrate than the first relative position is. Moreover, dry processing is performed on the substrate by rotating the substrate in a state where the top plate is located at a third relative position closer to the substrate than the second relative position is. This allows a chemical atmosphere above the substrate to be efficiently removed during the cleaning processing. Consequently, the occurrence of particles due to the chemical atmosphere above the substrate can be suppressed during the dry processing.